Zobrazeno 1 - 10
of 15
pro vyhledávání: '"DIPALI PANDYA"'
Publikováno v:
International Journal on Interactive Design and Manufacturing (IJIDeM).
Publikováno v:
Materials Today: Proceedings. 47:1025-1029
In tungsten inert gas (TIG) welding, less penetration depth is achieved in a single pass which adversely affects productivity, Activated TIG (A-TIG) welding techniques achieve better performances and higher penetration depths compared to conventional
Publikováno v:
Materials and Manufacturing Processes. 36:877-903
Stainless steel is a widely used material in various industries such as aerospace, chemical processing and transportation. Tungsten Inert Gas (TIG) or Gas Tungsten Arc Welding (GTAW) process is ext...
Publikováno v:
International Journal of Materials Engineering Innovation. 14:1
Publikováno v:
International Journal of Materials Engineering Innovation. 1:1
Autor:
Kelli Kurtovic, Gloria Broadwater, Laura J. Havrilesky, Rafael Gonzalez, Ashraf S. Habib, Jonathan Foote, Emma S Ryan, Dipali Pandya
Publikováno v:
Gynecologic oncology. 162(1)
To describe and evaluate the effects of implementation of a venous thromboembolism (VTE) prophylaxis quality improvement (QI) initiative on a gynecologic oncology service at a single institution.Prior to 2018, no consensus gynecologic oncology VTE pr
Autor:
Dhaval B. Shah, Dipali Pandya
Publikováno v:
Procedia Technology. :282-289
Tensile testing, also known as tension testing is a fundamental material technology test in which a sample is subjected to uniaxial tensile loading until failure. The results from the test are commonly used to select a material for different applicat
Autor:
Pandya, Dipali, Shah, Dhaval
Publikováno v:
Interdisciplinarity in Engineering; 2014, Vol. 14, p282-289, 8p
Autor:
ADALJA, ARCHANA
Publikováno v:
Desi Talk; 10/11/2024, Vol. 28 Issue 41, p5-5, 3/4p
Autor:
Pandya, Dipali1 (AUTHOR) dipali.svnit@gmail.com, Badgujar, Amarish1 (AUTHOR), Ghetiya, Nilesh2 (AUTHOR)
Publikováno v:
Materials & Manufacturing Processes. 2021, Vol. 36 Issue 8, p877-903. 27p.