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Autor:
Chupov, A. A., Zhdanov, A. E., Knyazev, S. T., Rakhmatullov, F. K., Rakhmatullov, R. F., Dolganov, A. Yu.
The concept of this article writing started up at the conference shortly after the 2021 IEEE 22nd International Conference of Young Professionals in Electron Devices and Materials (IEEE EDM 2021). We are grateful for the assistance of JSC «PA «UOMP
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______917::4539add4dd592f18126d2d9bb3d30f86
https://www.elibrary.ru/item.asp?id=48087951
https://www.elibrary.ru/item.asp?id=48087951