Zobrazeno 1 - 10
of 126
pro vyhledávání: '"D.Z Sun"'
Autor:
Tingyu Li, Yuying Sui, Rong Sun, Guoping Zhang, Ching-Ping Wong, Jinhui Li, Rui Xuan, D.Z. Sun, Chao Huang, Liang Shang
Publikováno v:
Journal of Materials Chemistry C. 8:14886-14894
Over the last few years, low-temperature curing polyimide (PI) has turned out to be a significant target for the advanced electronic package. Although the curing accelerators have been confirmed to be capable of significantly decreasing the curing te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15e3324db0f18ed5af16f479d70d7839
https://doi.org/10.1039/d0tc03770b
https://doi.org/10.1039/d0tc03770b
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
With the development of advanced packaging towards more complex heterogeneous integration, larger package carrier, thinner chip and smaller package size, the new temporary bonding material and technology is required, such as lower bonding temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::142c30deeab10f7507ce5fa8051fa14d
https://doi.org/10.1109/icept52650.2021.9568066
https://doi.org/10.1109/icept52650.2021.9568066
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
In the field of high brightness LED, the requirements of miniaturization, output and yield are urgent. At the same time, low k dielectric layers are more and more widely applied in integrated circuit filed, in order to solve the problem of crosstalk
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21043e9be1ed6651c1043c6a92dab226
https://doi.org/10.1109/icept52650.2021.9567994
https://doi.org/10.1109/icept52650.2021.9567994
Publikováno v:
Cereal Research Communications. :1-14
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd3a763ba1ad42750a5526038e3cdc4e
https://doi.org/10.1556/0806.47.2019.006
https://doi.org/10.1556/0806.47.2019.006
Autor:
Rong Sun, Jibao Lu, Guoping Zhang, Yunxia Wang, Changqing Li, Jinhui Li, Yuyang Yin, Yingying Li, D.Z. Sun
Publikováno v:
Polymer. 228:123963
One challenge in tailoring polyimide (PI) for microelectronics is to obtain excellent properties of films when cured at low temperature. To meet this challenge, this study put forwards an investigation of pyrazine moieties incorporated polyimide, whi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a049aacf82174e479a8f7f2fcd3aaee
https://doi.org/10.1016/j.polymer.2021.123963
https://doi.org/10.1016/j.polymer.2021.123963
Autor:
Guoping Zhang, D.D. Huang, D.Z. Sun, Jinhui Li, Mingqi Huang, Daquan Yu, Rui Xuan, Rong Sun, Jinshan Liu, Bincan Liu
Publikováno v:
Colloids and Surfaces A: Physicochemical and Engineering Aspects. 616:126339
The metallization of glass with high density and fine spacing possesses promising application in advanced package in 5 G. However, the adhesion strength between the copper and the smooth glass is still limited. In this paper, a feasible method is dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9625bb1290e9153710262329fc07887a
https://doi.org/10.1016/j.colsurfa.2021.126339
https://doi.org/10.1016/j.colsurfa.2021.126339
Autor:
Tao Wang, Yuying Sui, Chao Huang, Jinhui Li, Liang Shan, Guoping Zhang, D.Z. Sun, Fan Zhang, Rong Sun, Fangfang Niu
Publikováno v:
Polymer. 218:123514
Polyimides (PIs) with remarkable mechanical, thermal, dielectric properties have been extensively employed in electronic package of integrated circuit industry. However, PI is imidized at high temperature (>350 °C) traditionally, which limits its ap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28d38a686717195fc4b7469353555d75
https://doi.org/10.1016/j.polymer.2021.123514
https://doi.org/10.1016/j.polymer.2021.123514
Publikováno v:
Materials & Design. 32:877-884
Polymeric foams are typical materials for energy absorber in such areas as aircraft, car industry and in the field of electronic packaging. Besides the typical hyperelastic behaviour, non-linear stress–strain behaviour in large elastic deformation,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59febb0dc74a93984fcbe5b216975cad
https://doi.org/10.1016/j.matdes.2010.07.004
https://doi.org/10.1016/j.matdes.2010.07.004
Publikováno v:
Water Supply. 6:43-50
A fuzzy multiobjective-programming model was presented to determine appropriate environmental flow allocation in urban rivers. An integrated nonlinear fuzzy membership function, that represents a broader implication in fuzzy decision-making, was rega
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07fbfc3acfa4da0d66328e2ce93196a0
https://doi.org/10.2166/ws.2006.763
https://doi.org/10.2166/ws.2006.763
Publikováno v:
Journal of Crystal Growth. 244:229-235
Epitaxial growth of AlN has been performed by molecular beam epitaxy (MBE) with ammonia. The structural properties of materials were studied by cross-sectional transmission electron microscopy (TEM), X-ray diffraction (XRD), and atomic force microsco
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d9e6b3765157f411d35845a9556d564
https://doi.org/10.1016/s0022-0248(02)01650-0
https://doi.org/10.1016/s0022-0248(02)01650-0