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pro vyhledávání: '"D.O. Malyi"'
Publikováno v:
Fundamental and Applied Problems of Engineering and Technology. 5:122-130
The heat transfer processes in power semiconductor modules of soldered construction are studied using the methods of computer simulation in Comsol Multiphysics software. The problem of the thermal resistance of such modules is solved. The factors sho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62f98270768167cdcb92469c7bb7b65d
https://doi.org/10.33979/2073-7408-2020-343-5-122-130
https://doi.org/10.33979/2073-7408-2020-343-5-122-130
