Zobrazeno 1 - 3
of 3
pro vyhledávání: '"D.K.W. Chau"'
Publikováno v:
ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187).
Some lots of wafers were reported with low yield due to ANADC pattern functional failure. SEM, EDX and 155 Wright etch techniques were used to identify the root causes. Cross sectional results found the nodules on substrate at the contact area. EDX a
Autor:
H.F. Chan, J.H.M. Chan, P.C.K. Li, C.W.Z. Leung, G.H.F. Mak, Y.F. Cheung, D.K.W. Chau, P.M.Y. Lau
Publikováno v:
Hong Kong Physiotherapy Journal. 31:104
Publikováno v:
Hong Kong Physiotherapy Journal. (2):104