Zobrazeno 1 - 10
of 37
pro vyhledávání: '"D.J. Xie"'
Publikováno v:
Chemical Engineering Transactions, Vol 55 (2016)
Freeze-thaw placement in the drying process can reduce the average drying temperature of the sample. In order to speed up the drying process and maintain a good drying quality of dry tilapia fillets which were achieved in the condition of freeze-thaw
Externí odkaz:
https://doaj.org/article/5648d6deb9e7494ab47168141673f638
Autor:
L.G. Chen, L.L. Fan, D.J. Xie, T.Y. He, Y.S. Zheng, Y.Q. Cai, J.D. Rong, Muhammad Waqqas Khan Tarin
Publikováno v:
Applied Ecology and Environmental Research. 18:3981-4004
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63be639dc43742df12f5d0b1c3e4eac9
https://doi.org/10.15666/aeer/1803_39814004
https://doi.org/10.15666/aeer/1803_39814004
We consider the motion of individual two-dimensional vortices in general radially symmetric potentials in Bose-Einstein condensates. We find that although in the special case of the parabolic trap there is a logarithmic correction in the dependence o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2127::a89424e8323a8a41aae56baa9fb09e97
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3072366
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3072366
Autor:
D.J. Xie
Publikováno v:
Microelectronics Reliability. 40:1191-1198
A new accelerated stress test method was developed to evaluate creep life of flip-chip solder joints with underfill. With this method, a cyclic creep test can be done simply by applying a displacement to the FR-4 printed circuit board (PCB) board in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6302ecb193fe2e249789bad6cd3dc95e
https://doi.org/10.1016/s0026-2714(00)00046-9
https://doi.org/10.1016/s0026-2714(00)00046-9
Publikováno v:
Scopus-Elsevier
This paper reports some new experimental findings and theoretical analyses on the pore formation in surface mount solder joints fabricated using conventional infrared (IR) reflow soldering. Two major types of specimens are employed here: blank pad (w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1c21c3444318d6ec16f9b5954d7354b
https://doi.org/10.1016/0921-5107(95)01317-2
https://doi.org/10.1016/0921-5107(95)01317-2
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:148-153
This paper addresses the mechanism of pore growth and reports the results of an investigation on pore-free reflow soldering. An experimenting approach to obtain pore-free solder joints has been successfully developed. The method employed is to split
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4087e9d7635e81c163e7f87921ced994
https://doi.org/10.1109/96.486497
https://doi.org/10.1109/96.486497
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:669-678
A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The specimen used in the experiments is a quad flat pack (QFP)-solder-printed circuit board (PCB) assembly and the fabrication
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2d5339f78147942667bc366df84702d
https://doi.org/10.1109/96.533910
https://doi.org/10.1109/96.533910
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:679-684
This paper describes the improved characteristics of defect-free solder joints fabricated through modified reflow soldering. The modified method only requires that the solder joints are split for a very short time during a conventional solder reflow.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5dcfa94055e4a025d657e2db352f510e
https://doi.org/10.1109/96.533911
https://doi.org/10.1109/96.533911
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 18:715-719
A direct method to measure the fatigue life of surface mount solder joints is proposed. This approach makes use of a quad flat pack (QFP) solder-printed circuit board (PCB) assembly as a shear specimen. After the assembly and thermal stress screening
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f00f7998e142d1540bc4715ee1d6d570
https://doi.org/10.1109/96.475280
https://doi.org/10.1109/96.475280
Publikováno v:
Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'.
This paper describes a simple and reproducible method to obtain defect-free and reliable solder joints. That is to split the solder joints fabricated from an infrared (IR) reflow soldering process. The characteristics of split solder joints have been
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::427b4a4dffaae2e90bec8fb938970688
https://doi.org/10.1109/iemt.1995.526188
https://doi.org/10.1109/iemt.1995.526188