Zobrazeno 1 - 10
of 543
pro vyhledávání: '"D.J. Xie"'
Publikováno v:
Chemical Engineering Transactions, Vol 55 (2016)
Freeze-thaw placement in the drying process can reduce the average drying temperature of the sample. In order to speed up the drying process and maintain a good drying quality of dry tilapia fillets which were achieved in the condition of freeze-thaw
Externí odkaz:
https://doaj.org/article/5648d6deb9e7494ab47168141673f638
Autor:
L.G. Chen, L.L. Fan, D.J. Xie, T.Y. He, Y.S. Zheng, Y.Q. Cai, J.D. Rong, Muhammad Waqqas Khan Tarin
Publikováno v:
Applied Ecology and Environmental Research. 18:3981-4004
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63be639dc43742df12f5d0b1c3e4eac9
https://doi.org/10.15666/aeer/1803_39814004
https://doi.org/10.15666/aeer/1803_39814004
We consider the motion of individual two-dimensional vortices in general radially symmetric potentials in Bose-Einstein condensates. We find that although in the special case of the parabolic trap there is a logarithmic correction in the dependence o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2127::a89424e8323a8a41aae56baa9fb09e97
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3072366
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3072366
Autor:
Jugulete, Gheorghiță1,2 (AUTHOR) gheorghita.jugulete@umfcd.ro, Olariu, Mihaela Cristina1,2 (AUTHOR) mihaela.olariu@umfcd.ro, Stanescu, Raluca1 (AUTHOR) luminita.luminos@umfcd.ro, Luminos, Monica Luminita1,2 (AUTHOR) daniela.pacurar@umfcd.ro, Pacurar, Daniela1,3 (AUTHOR) carmen.pavelescu@rez.umfcd.ro, Pavelescu, Carmen1 (AUTHOR) madalina.merisescu@umfcd.ro, Merișescu, Mădălina-Maria1,2 (AUTHOR)
Publikováno v:
Viruses (1999-4915). Oct2024, Vol. 16 Issue 10, p1576. 12p.
Autor:
Wang, Chenlong1 (AUTHOR), Su, Yajuan1 (AUTHOR), Shahriar, S. M. Shatil1 (AUTHOR), Li, Yu2 (AUTHOR), Xie, Jingwei1,3 (AUTHOR) jingwei.xie@unmc.edu
Publikováno v:
Microbial Biotechnology. Oct2024, Vol. 17 Issue 10, p1-13. 13p.
Autor:
Naidoo, Karishma1 (AUTHOR) karishma280199@gmail.com, Khathi, Andile1 (AUTHOR)
Publikováno v:
Molecules. Sep2024, Vol. 29 Issue 18, p4410. 13p.
Autor:
Liu, Qianhui1,2 (AUTHOR) m220351069@st.shou.edu.cn, Wu, Qian1,2 (AUTHOR) d220300083@st.shou.edu.cn, Xu, Tianming1,2 (AUTHOR) d230300096@st.shou.edu.cn, Malakar, Pradeep K.1,2 (AUTHOR) pkmalakar@shou.edu.cn, Zhu, Yongheng1,2 (AUTHOR) yh-zhu@shou.edu.cn, Liu, Jing1,2 (AUTHOR) d210300079@st.shou.edu.cn, Zhao, Yong1,2 (AUTHOR) yzhao@shou.edu.cn, Zhang, Zhaohuan1,2 (AUTHOR) yzhao@shou.edu.cn
Publikováno v:
International Journal of Molecular Sciences. Sep2024, Vol. 25 Issue 17, p9496. 17p.
Autor:
Lovynska, Viktoriia1,2 (AUTHOR) svitlana.sytnyk@uni-bielefeld.de, Bayat, Bagher1 (AUTHOR) b.bayat@fz-juelich.de, Bol, Roland1 (AUTHOR) r.bol@fz-juelich.de, Moradi, Shirin1 (AUTHOR) s.moradi@fz-juelich.de, Rahmati, Mehdi1 (AUTHOR) m.rahmati@fz-juelich.de, Raj, Rahul1 (AUTHOR) r.raj@fz-juelich.de, Sytnyk, Svitlana2,3 (AUTHOR), Wiche, Oliver4 (AUTHOR) oliver.wiche@hszg.de, Wu, Bei1 (AUTHOR) b.wu@fz-juelich.de, Montzka, Carsten1 (AUTHOR) c.montzka@fz-juelich.de
Publikováno v:
Remote Sensing. Sep2024, Vol. 16 Issue 17, p3221. 30p.
Autor:
D.J. Xie
Publikováno v:
Microelectronics Reliability. 40:1191-1198
A new accelerated stress test method was developed to evaluate creep life of flip-chip solder joints with underfill. With this method, a cyclic creep test can be done simply by applying a displacement to the FR-4 printed circuit board (PCB) board in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6302ecb193fe2e249789bad6cd3dc95e
https://doi.org/10.1016/s0026-2714(00)00046-9
https://doi.org/10.1016/s0026-2714(00)00046-9
Publikováno v:
Scopus-Elsevier
This paper reports some new experimental findings and theoretical analyses on the pore formation in surface mount solder joints fabricated using conventional infrared (IR) reflow soldering. Two major types of specimens are employed here: blank pad (w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1c21c3444318d6ec16f9b5954d7354b
https://doi.org/10.1016/0921-5107(95)01317-2
https://doi.org/10.1016/0921-5107(95)01317-2