Zobrazeno 1 - 10
of 197
pro vyhledávání: '"D.J. Schwab"'
Autor:
K. Fritz, M.A. Daun-Lindberg, J.F. Prairie, J.S. Humble, E.S. Daniel, D.J. Schwab, R.A. Kertis, Barry K. Gilbert, R.A. Philpott
Publikováno v:
IEEE Journal of Solid-State Circuits. 44:2295-2311
The design and wafer probe test results of a 5-bit SiGe flash ADC are presented. The integrated circuit, fabricated in a 200/250 GHz fT/Fmax, SiGe BiCMOS technology, provides a 5-bit analog to digital conversion with dual Nyquist operation at sample
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b6bab690d70b71a21ccbff39028c7b0
https://doi.org/10.1109/jssc.2009.2022672
https://doi.org/10.1109/jssc.2009.2022672
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:79-91
An investigation of the high-frequency performance of laminate multichip module (MCM-L) technology was undertaken with the goal of demonstrating its appropriateness for the development of digital radar receivers operating in the X band (8 to 12 GHz).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62610a1a670a5e6ecf9405cf068b38ef
https://doi.org/10.1109/tadvp.2002.1017689
https://doi.org/10.1109/tadvp.2002.1017689
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Barry K. Gilbert, D.C. Benson, B.L. Donham, D.B. Tuckerman, B.A. Randall, W.P. Goodwin, D.J. Schwab
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 20:17-26
Two different deposited multichip modules (MCMs) were fabricated in nCHIP's nC3000 Si/Cu/SiO/sub 2/ process. The first of these MCMs was a passive test coupon containing a variety of microstrip and stripline transmission line structures, allowing the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b504176366047a084b1f8e34741fdfa2
https://doi.org/10.1109/96.554517
https://doi.org/10.1109/96.554517
Autor:
Barry K. Gilbert, B.A. Randall, D. Walter, D.J. Schwab, L.E. Roszel, G.J. Fokken, J.J. Kacines, T.M. Schaefer, L. Mowatt
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:403-416
In this paper, we describe the development and measurement of two separate test structures, or "coupons" to assess the performance of Texas Instruments' "chips-first" multichip module technology at high operating clock rates, A "passive" coupon conta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4271995e4e7651f262890aef55f5f75f
https://doi.org/10.1109/96.496045
https://doi.org/10.1109/96.496045
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 44:300-303
In this paper, we describe the development of a theoretical field-based or "wave" model which we are employing in an attempt to characterize the ground/power plane (e.g., the V/sub cc/ plane) structure of a printed wiring board (PWB) or multichip mod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f15ad2cf3d7bc270f9b8ff095395b66
https://doi.org/10.1109/19.377836
https://doi.org/10.1109/19.377836
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
K.A. Fritz, R.A. Philpott, Barry K. Gilbert, J.S. Humble, M.A. Daun-Lindberg, R.A. Kertis, E.S. Daniel, J.F. Prairie, D.J. Schwab
Publikováno v:
2008 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
The design and wafer probe test results of a 5-bit SiGe ADC are presented. The integrated circuit, fabricated in a 200/250 GHz fT/Fmax, SiGe BiCMOS technology, provides a 5-bit analog to digital conversion with input tone frequencies up to 20 GHz and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d75aef37ec273d58f81e5979bda6a912
https://doi.org/10.1109/bipol.2008.4662755
https://doi.org/10.1109/bipol.2008.4662755
Autor:
D.J. Schwab, K.E. Bliley, E.S. Daniel, Barry K. Gilbert, S.K. Zahn, James A. Levine, Paul H. Kane, K.L. Rowley
Publikováno v:
2007 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society.
In recent years, there has been much research and development of wearable devices using accelerometers for studying physical activity. Previously, we have described the development of the Posture and Activity Detector (PAD). After demonstrating succe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e779b3370161f3ffbcccee2e2fec8e5b
https://doi.org/10.1109/iembs.2007.4352876
https://doi.org/10.1109/iembs.2007.4352876