Zobrazeno 1 - 10
of 41
pro vyhledávání: '"D.I. Amey"'
Publikováno v:
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Opto-electronic and MEMS packages require unique capabilities over and above traditional hermetic multichip modules. In addition to hermeticity or vacuum atmosphere, opto-electronic systems require direct input/output of optical, RF and other sensiti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5dedfead5bb0506e64c411a7251b593a
https://doi.org/10.1109/ectc.2002.1008104
https://doi.org/10.1109/ectc.2002.1008104
Publikováno v:
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
A new "high density" gold thick film technology is introduced. Circuits produced using the new material system exhibit superior fine line definition, conductivity density and high frequency performance. The high frequency performance of etched "high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a693c00108e0ea00de6299fe663bd307
https://doi.org/10.1109/icmcm.1998.670781
https://doi.org/10.1109/icmcm.1998.670781
Publikováno v:
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
Recognizing the need for improved materials data to meet the needs of designers of RF and microwave products, DuPont Photopolymers and Electronic Materials (P&EM) has had an ongoing program to generate high frequency data on materials properties (die
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bae1098ec5b05416b24a1e08c9bb7971
https://doi.org/10.1109/isapm.1998.664446
https://doi.org/10.1109/isapm.1998.664446
Publikováno v:
Proceedings 1997 International Conference on Multichip Modules.
In this paper, the results of a cost model study comparing Diffusion Patterning/sup TM/, Fodel(R), and Green Tape/sup TM/ implementations of a 10 chip Viking SuperSPARC/sup TM/ Module is reviewed. Results include a discussion of key assumptions and a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adbedb7af866ddf6b5de49fe375e564d
https://doi.org/10.1109/icmcm.1997.581147
https://doi.org/10.1109/icmcm.1997.581147
Autor:
S.J. Horowitz, D.I. Amey
Publikováno v:
Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.
A major test program to characterize advanced interconnection materials in the 1 to 20 GHz range was initiated. The material systems which were tested include a variety of new Thick Film and Low Temperature Cofired Ceramic (LTCC) dielectrics as well
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8c3bffdaf90ffe1047b3829b54b6f8b
https://doi.org/10.1109/isapm.1997.581283
https://doi.org/10.1109/isapm.1997.581283
Publikováno v:
Proceedings 1997 International Conference on Multichip Modules.
A ten-chip, high-performance workstation multichip module, implemented in MCM-D technology, was redesigned utilizing three ceramic technologies Fodel/sup (R/), Diffusion Patterning/sup TM/, and low temperature cofired ceramic-and one laminate-based a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41d7e8814dc01da1b1656f7987361903
https://doi.org/10.1109/icmcm.1997.581175
https://doi.org/10.1109/icmcm.1997.581175
Autor:
D.I. Amey, J.W. Balde
Publikováno v:
Computer. 10:58-68
The chip carrier concept was originally conceived as a square ceramic semiconductor package that could be surface reflow soldered to a ceramic substrate. Its advantages of reduced package size, higher board packing density, lower lead inductance and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c789e09f57a8ca5dfc924d4bd26f740
https://doi.org/10.1109/c-m.1977.217602
https://doi.org/10.1109/c-m.1977.217602
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.