Zobrazeno 1 - 10
of 29
pro vyhledávání: '"D.C. Sekar"'
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:79-87
Power dissipation in microprocessors is projected to reach a level that may necessitate chip-level liquid cooling in the near future. An on-chip microchannel heat sink can reduce the total thermal interfaces between an integrated circuit chip and the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0477ef534a1d9429611fbf9d025c3ab2
https://doi.org/10.1109/tadvp.2009.2035999
https://doi.org/10.1109/tadvp.2009.2035999
Publikováno v:
IEEE Electron Device Letters. 28:767-769
It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is reboo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9836d6ddcdc919f6ed435d6f88574176
https://doi.org/10.1109/led.2007.902165
https://doi.org/10.1109/led.2007.902165
Publikováno v:
2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference.
Three-dimensional (3D) system integration is widely accepted as a key enabler for future systems. Although there are a number of approaches to 3D integration, none have addressed the need for cooling in a 3D stack of high-performance chips (microproc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbd2fa4e5df1d052bd67cfb4fdec4387
https://doi.org/10.1109/avfop.2008.4653149
https://doi.org/10.1109/avfop.2008.4653149
Autor:
Calvin King, Gang Huang, Muhannad S. Bakir, B. Dang, Hiren D. Thacker, James D. Meindl, Azad Naeemi, D.C. Sekar
Publikováno v:
CICC
This paper describes a novel 3D integration technology that enables the integration of electrical, optical, and microfluidic interconnects in a 3D die stack. The electrical interconnects are used to provide power delivery and signaling, the optical i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8118b3af864cf7bca176661ce1939c0
https://doi.org/10.1109/cicc.2008.4672173
https://doi.org/10.1109/cicc.2008.4672173
Autor:
Paul F. Joseph, James D. Meindl, Todd J. Spencer, Hiren D. Thacker, B. Dang, D.C. Sekar, Muhannad S. Bakir, Calvin King
Publikováno v:
2008 International Interconnect Technology Conference.
A 3D-IC technology with integrated microchannel cooling is demonstrated in this paper. Fluidic interconnect network fabrication proceeds at the wafer-level, is compatible with CMOS processing and flip-chip assembly and requires four lithography steps
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99892d32800994bb43ff8cfe29f0a682
https://doi.org/10.1109/iitc.2008.4546911
https://doi.org/10.1109/iitc.2008.4546911
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Motivations for three-dimensional (3D) integration include reduction in system size, interconnect delay, power dissipation and enabling hyper-integration of chips fabricated using disparate process technologies. Although various low-power commercial
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f45f5282866ad9fc501ccff6803ed89
https://doi.org/10.1109/ectc.2008.4549941
https://doi.org/10.1109/ectc.2008.4549941
Autor:
James D. Meindl, D.C. Sekar
Publikováno v:
2007 IEEE International Interconnect Technology Conferencee.
This paper studies the impact of multi-core architectures on design of chip-level interconnect networks. A dual core 3 GHz processor is found to require 23% fewer metal levels than a single core 6 GHz processor while a quad core 1.5 GHz processor nee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d637d36103da6c22d18e472dfc1fd741
https://doi.org/10.1109/iitc.2007.382371
https://doi.org/10.1109/iitc.2007.382371
Publikováno v:
CICC
An analytical physical model is derived for the first time to predict the first droop power supply noise for non-uniform current switching conditions and arbitrary functional block sizes. The model not only captures the impact of package parameters a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88da27caa0658cf9a21a7acb31e6c10e
https://doi.org/10.1109/cicc.2007.4405859
https://doi.org/10.1109/cicc.2007.4405859
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
Compact physical models are derived for predicting power supply noise of chips in the gigascale integration (GSI) era. These models consider both IR-drop and simultaneous switching noise (SSN) and give a quick full waveform description of the first d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31faec6fd43c5a18feb238d48d857f4f
https://doi.org/10.1109/ectc.2007.374017
https://doi.org/10.1109/ectc.2007.374017
Publikováno v:
2006 International Interconnect Technology Conference.
Power consumed by interconnect repeaters is a serious concern for future ICs. Ways to tackle this issue such as unique optimization of repeater and logic transistor technologies, improved repeater insertion methods and 3D integration are discussed. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af4ea244d636aa7f8b1d55166b63e3d9
https://doi.org/10.1109/iitc.2006.1648687
https://doi.org/10.1109/iitc.2006.1648687