Zobrazeno 1 - 10
of 231
pro vyhledávání: '"D. VIA"'
Publikováno v:
EDFA Technical Articles. 23:12-18
Traditional post-fabrication testing can reliably verify whether or not an IC is working correctly, but it cannot tell the difference between an authentic and counterfeit chip or recognize design changes made with malicious intent. This article prese
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21f111ad908e3e93ef75a63704effb5c
https://doi.org/10.31399/asm.edfa.2021-1.p012
https://doi.org/10.31399/asm.edfa.2021-1.p012
Publikováno v:
Poultry Science, Vol 103, Iss 12, Pp 104293- (2024)
ABSTRACT: Citrus pectin (CP) is a dietary fiber used in animal nutrition with anti-inflammatory properties. CP downregulates chicken immunoregulatory monocytes' functions, like chemotaxis and phagocytosis, in vitro. The molecular underlying backgroun
Externí odkaz:
https://doaj.org/article/1a614d20c8d946ecbd98eb11dd66a684
Publikováno v:
Journal of the American Psychiatric Nurses Association. 28:339-344
BACKGROUND: The magnitude for potential burnout is enormous. The Centers for Disease Control and Prevention, Center for Addiction and Mental Health, and Substance Abuse and Mental Health Services Administration reported diagnoses of psychiatric and s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3076e32b0fccc8285348adbc06808978
https://doi.org/10.1177/1078390320970640
https://doi.org/10.1177/1078390320970640
Autor:
Andrew Elliott, James Schaffranek, Matthew Sutter, Mike Strizich, Adam G. Kimura, Glen D. Via, Jon Scholl
Publikováno v:
Journal of Hardware and Systems Security. 4:34-43
This paper reviews a developed integrated circuit (IC) decomposition workflow that can be leveraged for extracting design files and performing advanced verification and validation techniques on fabricated chips. In this work, a commercial 130-nm micr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac678ac41e1b3af4330e38085cbddf7f
https://doi.org/10.1007/s41635-019-00086-6
https://doi.org/10.1007/s41635-019-00086-6
Autor:
Eric Udelhoven, Joshua Baur, Adam R. Waite, Daniel Brooks, John Kelley, Yash Patel, Richard Ott, Jon Scholl, Glen D. Via, Adam G. Kimura
This paper presents the first design reconstruction on the Front-End-of-Line and Middle-of-Line layers of a 14 nm node FinFET design. To accomplish this, a large region of interest within a custom designed 14 nm node ASIC device was delayered, imaged
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5f134dd8b0b6196cf1a1d4a3926447c9
https://doi.org/10.36227/techrxiv.15182256
https://doi.org/10.36227/techrxiv.15182256
Autor:
Joshua Baur, Adam G. Kimura, Adam R. Waite, Jonathan Scholl, John Kelley, Yash Patel, Glen D. Via
Publikováno v:
2020 IEEE Physical Assurance and Inspection of Electronics (PAINE).
This paper reviews different methods for mounting and integrated circuit (IC) for delayering. In this work, several 130nm technology devices are observed during the delayering process as a means of evaluating the advantages and disadvantages of vario
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d2ba89e9156557399624a2891c8d7b8
https://doi.org/10.1109/paine49178.2020.9337731
https://doi.org/10.1109/paine49178.2020.9337731
Publikováno v:
2020 IEEE Physical Assurance and Inspection of Electronics (PAINE).
This paper reviews the decomposition of a fabricated Serial Peripheral Interface (SPI) that was manufactured in a 130 nm process node technology to establish a verification and validation methodology for baselining microelectronics assurance. The fab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e2df2d520becf265f302921fa56e37a
https://doi.org/10.1109/paine49178.2020.9337733
https://doi.org/10.1109/paine49178.2020.9337733
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents an in-depth review of the critical front end stages of the fabricated integrated circuit (IC) assurance workflow used for recovering the design stack-up of a fabricated IC. In this work, a Serial Peripheral Interface (SPI) embedde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14d1b2506e76aa07afc7e98bdfd35fe7
https://doi.org/10.31399/asm.cp.istfa2020p0202
https://doi.org/10.31399/asm.cp.istfa2020p0202
Autor:
Kamala D. Via
Publikováno v:
The Journal for Nurse Practitioners. 17:247-248
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3cf8ad325bc300b74f3dcb788c91ce1
https://doi.org/10.1016/j.nurpra.2020.10.022
https://doi.org/10.1016/j.nurpra.2020.10.022
Publikováno v:
Microelectronics Reliability. 68:13-20
The reliability of commercial-off-the-shelf (COTS) GaN HEMTs was studied after irradiation using heavy ions of Neon (Ne), Silicon (Si), and Argon (Ar). Devices were exposed to heavy ions at a flux of ~ 1.8e4 ions/cm2-sec to a fluence of 1.5e5 ions/cm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03bb87112a1f9b5ff3daf951095351d4
https://doi.org/10.1016/j.microrel.2016.09.017
https://doi.org/10.1016/j.microrel.2016.09.017