Zobrazeno 1 - 10
of 175
pro vyhledávání: '"D. Shroff"'
Autor:
Kuntal H. Patel, Bhavesh D. Shroff
Publikováno v:
International Journal of Research in Medical Sciences. 11:2015-2021
Background: Cerebrovascular accident (Stroke) is a non-communicable disease of increasing importance. According to the World Health Organization, 15 million people suffer from stroke worldwide each year. The National Commission on Macroeconomics and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::585c567a25a2c6b3cd43a7cf1403fbac
https://doi.org/10.18203/2320-6012.ijrms20231610
https://doi.org/10.18203/2320-6012.ijrms20231610
Publikováno v:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9afc90995e53730cd63f588119063aa
https://doi.org/10.1109/ipfa55383.2022.9915769
https://doi.org/10.1109/ipfa55383.2022.9915769
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Nicholas E. Anton, Guoyang Zhou, Tera Hornbeck, Amy M. Nagle, Susan Norman, Anand D. Shroff, Denny Yu
Publikováno v:
Applied Ergonomics. 109:103988
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da1c88b49310980722bbba06c176b2c1
https://doi.org/10.1016/j.apergo.2023.103988
https://doi.org/10.1016/j.apergo.2023.103988
Publikováno v:
Integration. 70:90-98
Time-dependent dielectric breakdown (TDDB) has become an important cause of failure for inter-metal dielectrics (IMD) in integrated circuits as feature sizes continue to shrink and novel materials are introduced. Although many studies have been condu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d7e22a8be56996fae1a736198c27bc2
https://doi.org/10.1016/j.vlsi.2019.09.012
https://doi.org/10.1016/j.vlsi.2019.09.012
Publikováno v:
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ad86ae35287d9e02382d90b7a7614eb
https://doi.org/10.1109/ipfa53173.2021.9617238
https://doi.org/10.1109/ipfa53173.2021.9617238
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 37:3137-3150
In this paper, we present a novel and fast electromigration (EM) immortality check for general multisegment interconnect wires. Instead of using current density as the key parameter, as in traditional EM analysis methods based on Black’s equation a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::538e547a0438e4a96eb74de7b09eba0b
https://doi.org/10.1109/tcad.2018.2801221
https://doi.org/10.1109/tcad.2018.2801221
Autor:
Alvin Leng Sun Loke, Mehul D. Shroff
Publikováno v:
Design-Process-Technology Co-optimization XV.
Semiconductor demand is rapidly expanding beyond the computing and mobile markets with more products being introduced for automotive, industrial, medical, avionics, and space applications. Chips are increasingly complex with growing functionality thr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fee8e8db8454e993d9d7bf076ba09b99
https://doi.org/10.1117/12.2585220
https://doi.org/10.1117/12.2585220
Publikováno v:
National Journal of Medical Research, Vol 2, Iss 04 (2012)
Background: Shoulder arthroplasty offer pain relief and improement in patients of shoulder arthritis. Appropriate fixation of glenoid component of scapula is essential to evade loosening which is the common indication for revision surgery. The glenoi
Externí odkaz:
https://doaj.org/article/53b8e19794e94f76b97d2ca3785023fe
Autor:
Joris Beld, Bradley Studnitzer, Kristen E. Fiore, Valentine C. Courouble, Louise K. Charkoudian, Miranda C. Baker, Kerilyn N. Godbe, Kavita D. Shroff, Karl A. Johnson, David L. Cookmeyer, Ashley C. Sisto, Adam R. Huff, Stephen T. Ridings, Keisuke Sawada, Aurelio Mollo, Saadia Nawal, Michael R. Jordan, Marco A. Rivas, Emily N. Krasnow, Robert Fairman, Alexander J. Frost, Bashkim Kokona, Grace A. R. Thiele
Publikováno v:
AIChE Journal. 64:4308-4318
The successful engineering of biosynthetic pathways hinges on understanding the factors that influence acyl carrier protein (ACP) stability and function. The stability and structure of ACPs can be influenced by the presence of divalent cations, but h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3acfdd8d0917beebcfc632634160acf5
https://doi.org/10.1002/aic.16402
https://doi.org/10.1002/aic.16402