Zobrazeno 1 - 10
of 58
pro vyhledávání: '"D. S. Weiss"'
Publikováno v:
New Journal of Physics, Vol 16, Iss 9, p 095006 (2014)
In the past few years, there have been significant advances in understanding out-of-equilibrium dynamics in strongly interacting many-particle quantum systems. This is the case for 1D dynamics, where experimental advances—both with ultracold atomic
Externí odkaz:
https://doaj.org/article/f8d9ea43de69480f9f523705aa3a7eff
Autor:
M. C. Zaretsky, Kenneth J. Brown, Donald S. Rimai, M. Aslam, K. Lofftus, D. S. Weiss, W. Y. Fowlkes
Publikováno v:
Journal of Adhesion Science and Technology. 24:583-617
Various aspects of adhesion play significant roles in digital printing, especially when electrophotographic technology is employed. This paper will concentrate on the adhesion and removal of toner particles, the marking particles used in the electrop
Publikováno v:
The Journal of Physical Chemistry C. 113:1067-1073
Transient conductivity measurements have been carried out in a hydrazone-polycarbonate molecularly doped polymer over wide dynamic ranges of time and current as a function of the applied electric field. These data are plotted using both linear−line
Publikováno v:
Journal of Adhesion Science and Technology. 22:529-543
The adhesion and cohesion of micrometer-size particles are governed by complex interactions involving van der Waals and electrostatic forces. For many applications, such as the toner particles used in electrophotographic engines, these interactions a
Publikováno v:
Journal of Imaging Science and Technology. 49:531-538
Publikováno v:
Journal of Adhesion Science and Technology. 17:917-942
Particle adhesion and removal is often controlled by the interplay of electrostatic forces, related to electrical charges on the particles, and electrodynamic forces, such as those arising from van der Waals interactions. In addition, when electrosta
Publikováno v:
Journal of Imaging Science and Technology. 44:429-432
Publikováno v:
Journal of Imaging Science and Technology. 43:280-287
Publikováno v:
NIP & Digital Fabrication Conference. 14:520-523
Publikováno v:
Journal of Imaging Science and Technology. 40:322-326