Zobrazeno 1 - 10
of 53
pro vyhledávání: '"D. R. Frear"'
Publikováno v:
Journal of Electronic Materials. 49:3251-3258
Solder joints can experience fatigue cracking at the interface between the solder and substrate during thermal cycling due to the difference in thermal expansion between joined components. In order to strengthen the interfacial region and prevent cra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f109863cecd7e2d3eaef7fe57b55a234
https://doi.org/10.1007/s11664-020-08013-0
https://doi.org/10.1007/s11664-020-08013-0
Publikováno v:
Journal of Electronic Materials. 49:4466-4467
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4ceb79bf4c4032d70387d144854eb67
https://doi.org/10.1007/s11664-020-08156-0
https://doi.org/10.1007/s11664-020-08156-0
Autor:
D. R. Frear, J. W. Jang
Publikováno v:
Journal of the Korean Physical Society. 59:402-407
High strain-rate drop impact tests were performed for land grid array (LGA) packages with (electroless nickel immersion gold) ENIG metallization and lead-free solder interconnects. Sn-4Ag-0.5Cu (in wt%, SAC405), Sn-3.5Ag (in wt%), and Sn-0.7Cu (in wt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aeaba50e46e4083766ebf1bf5d6d6c21
https://doi.org/10.3938/jkps.59.402
https://doi.org/10.3938/jkps.59.402
Autor:
D. R. Frear
Publikováno v:
Journal of Materials Science: Materials in Electronics. 18:319-330
Consumer electronic applications are the primary target of the Pb-free initiative and package assembly and performance is affected by the move from eutectic Sn-Pb to Pb-free solder alloys. This paper outlines the key issues and mitigation possibiliti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49fb9b2d4d615819b51eb96312415273
https://doi.org/10.1007/s10854-006-9021-7
https://doi.org/10.1007/s10854-006-9021-7
Autor:
D. R. Frear, S. Thomas
Publikováno v:
MRS Bulletin. 28:68-74
IntroductionThe trend for microelectronic devices has historically been, and will continue to be, toward a smaller feature size, faster speeds, more complexity, higher power, and lower cost. The driving force behind these advances has traditionally b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::652a8b7ccf60dcf750cf394cbf4107cc
https://doi.org/10.1557/mrs2003.20
https://doi.org/10.1557/mrs2003.20
Autor:
J. W. Jang, T. Y. Lee, Kejun Zeng, King-Ning Tu, S. M. Kuo, D. R. Frear, W. J. Choi, J. K. Lin, Jorma Kivilahti
Publikováno v:
Journal of Materials Research. 17:291-301
Intermetallic compound (IMC) growth during solid-state aging at 125, 150, and 170 °C up to 1500 h for four solder alloys (eutectic SnPb, Sn–3.5Ag, Sn–3.8Ag–0.7Cu, and Sn–0.7Cu) on Cu under bump metallization was investigated. The samples wer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b86df2f56d4c8b79358fb2eefceb2ac0
https://doi.org/10.1557/jmr.2002.0042
https://doi.org/10.1557/jmr.2002.0042
Publikováno v:
JOM. 53:28-33
A variety of lead-free solder alloys were studied for use as flip-chip interconnects including Sn-3.5Ag, Sn-0.7Cu, Sn-3.8Ag-0.7Cu, and eutectic Sn-37Pb as a baseline. The reaction behavior and reliability of these solders were determined in a flip-ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36409880a967a3a661a9797ab110a0f1
https://doi.org/10.1007/s11837-001-0099-3
https://doi.org/10.1007/s11837-001-0099-3
Publikováno v:
Journal of Applied Physics. 89:4843-4849
The reaction kinetics of eutectic SnPb solder on Cu were studied and compared in the liquid state at 200 to 240 °C and in the solid state aged at 125–170 °C. The ternary phase diagrams of SnPbCu, the morphology of intermetallic compound (IMC), an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c185d6e514f582e435c119911a3fc5bf
https://doi.org/10.1063/1.1357469
https://doi.org/10.1063/1.1357469
Publikováno v:
Journal of Applied Physics. 89:3189-3194
The electromigration of eutectic SnPb solder interconnects between a Si chip and a FR4 substrate was studied at 120 °C for up to 324 h with current stressing of 104 amp/cm2. Hillocks were observed at the anode and voids at the cathode. The dominant
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b655215ba12e3d73b7a6f26779dde16f
https://doi.org/10.1063/1.1342023
https://doi.org/10.1063/1.1342023
Autor:
D. R. Frear
Publikováno v:
e & i Elektrotechnik und Informationstechnik. 118:81-86
A variety of Pb-free solder alloys have been proposed for use as interconnects for electronic packaging including Sn−Ag, Sn−Cu, Sn−Ag−Cu, Sn−Ag−Bi, and Sn−Sb, among others. This paper presents a review of the behavior of promising Pb-fr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f60e30bccf9cce0fd1650583a0d0729
https://doi.org/10.1007/bf03157756
https://doi.org/10.1007/bf03157756