Zobrazeno 1 - 10
of 4 450
pro vyhledávání: '"D. Pak"'
Autor:
Endlich, D.1 dirk.endlich@elopak.com
Publikováno v:
SOFW Journal (English version). May2024, Vol. 150 Issue 5, p40-43. 4p.
Autor:
Endlich, D.1 dirk.endlich@elopak.com
Publikováno v:
SOFW Journal (German version). mai2024, Vol. 150 Issue 5, p42-45. 4p.
Autor:
Iuliia G. Samoilova, Daria V. Podchinenova, Mariia V. Matveeva, Oxana A. Oleynik, Anastasia E. Stankova, Dmitry A. Kudlay, Anastasiia А. Mazurina, Iuliia D. Pak, Marina I. Kharakhulah
Publikováno v:
Терапевтический архив, Vol 96, Iss 3, Pp 286-291 (2024)
Background. Type 2 diabetes mellitus (DM) remains the most common type of DM and is associat-ed with disabling complications, reduced quality of life and reduced life expectancy. Satisfactory control of carbohydrate metabolism remains the key way to
Externí odkaz:
https://doaj.org/article/437b7007896a462ab49f511f5b495aee
Autor:
Vladimir L. Sofronov, Evgeniy U. Kartashov, Semen A. Tkachuk, Alexander D. Pak, Vasiliy V. Tinin, Andrey A. Galata
Publikováno v:
Известия Томского политехнического университета: Инжиниринг георесурсов, Vol 333, Iss 11, Pp 171-182 (2022)
The relevance of the study is caused by the need to find a new, more efficient method for decontamination of large volumes of metal waste contaminated with radioactive substances. The accumulation of this type of waste is associated with the producti
Externí odkaz:
https://doaj.org/article/932499439ff446f7bded1e61dd1b326b
Publikováno v:
Pharma + Food. 9/19/2023, p1-1. 1p. 3 Color Photographs.
Publikováno v:
Компоненты и Технологии.
Авторы статьи, имея многолетний опыт в области сборки и монтажа изделий электроники, разрабатывают новые автоматизированные процессы м
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2806::8697a6a9e81622a0edf515cad6aa003b
http://cyberleninka.ru/article/n/osobennosti-sborki-tranzistorov-v-korpuse-d-pak
http://cyberleninka.ru/article/n/osobennosti-sborki-tranzistorov-v-korpuse-d-pak
Publikováno v:
2006 7th International Conference on Electronic Packaging Technology.
Wire bonding is the most critical process in package assembly manufacturing. Among the wire bond-related failure mechanisms wedge bond heel crack is quite common and critical in the semiconductor industry. This paper focuses on enhancing the robustne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5dcfbd208b9f5952a86ce4e945196da
https://doi.org/10.1109/icept.2006.359767
https://doi.org/10.1109/icept.2006.359767
Publikováno v:
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
D-Pak package transistors of the raised heat dispersion capacity have a copper alloy crystal mount for maintenance of low thermal resistance. Various technologies of SMT soldering are connected to intensive heating, danger bursting transistor structu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::354f0ef75f8f78faa980f37fa82fedb3
https://doi.org/10.1109/hdp.2005.251417
https://doi.org/10.1109/hdp.2005.251417