Zobrazeno 1 - 10
of 179
pro vyhledávání: '"D. P. Siddons"'
Autor:
Abdul K. Rumaiz, Conan Weiland, Ian Harding, Neha S. Nooman, Thomas Krings, Ethan L. Hull, Gabriele Giacomini, Wei Chen, Eric Cockayne, D. Peter Siddons, Joseph C. Woicik
Publikováno v:
AIP Advances, Vol 13, Iss 1, Pp 015305-015305-8 (2023)
Development of a robust, thin, hole-blocking (n+) contact on high purity germanium (HPGe) has been the main challenge in the development of Ge-based radiation sensors. Yttrium has been reported to be a viable hole-blocking contact on HPGe, and detect
Externí odkaz:
https://doaj.org/article/18bb9faa638242df961b1ef15d964e60
Autor:
V. Singh, Xin Yuan, David J. Brady, K. Nakhoda, Mourad Idir, Erik R. Farquhar, Michael Sullivan, J. Khanfri, Donald Abel, Ryan Tappero, D. P. Siddons, Abdul K. Rumaiz, Anthony Kuczewski
Publikováno v:
Journal of Synchrotron Radiation
First results from a 10 µm MURA coded aperture optic for a full-field X-ray fluorescence microscope are presented.
The design and construction of an instrument for full-field imaging of the X-ray fluorescence emitted by a fully illuminated samp
The design and construction of an instrument for full-field imaging of the X-ray fluorescence emitted by a fully illuminated samp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ce0d4affd58571dfa14e1072f7845760
http://europepmc.org/articles/PMC7642964
http://europepmc.org/articles/PMC7642964
Publikováno v:
2008 GSW Proceedings.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af99a9520bb241357c34a9aad7d7bcd0
https://doi.org/10.18260/1-2-620-38577
https://doi.org/10.18260/1-2-620-38577
Publikováno v:
IEEE Transactions on Nuclear Science. 66:2245-2251
Arrays of silicon sensors can be used in those spectroscopic applications where a high event throughput is needed, for example, in synchrotron-based experiments. However, in such arrays, several noise contributions, beyond the well-known leakage, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3aa8f0288f7dad414dbc448640c8447d
https://doi.org/10.1109/tns.2019.2943067
https://doi.org/10.1109/tns.2019.2943067
Autor:
D. Parry, R. Szymanski, Si-Yu Hu, R. Kirkham, David N. Jamieson, D. P. Siddons, P.A. Dunn, G.F. Moorhead, F. Rudzik, P. Davey, R. Dodanwela, Jamie S. Laird, Anthony Kuczewski, S. Hogan, Chris Ryan, M. Jensen
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 449:11-16
A Maia detector array has been adapted and installed on the CSIRO-MARC Nuclear Microprobe. Maia uses an annular array of 384 silicon detectors to provide a solid-angle of 1.3 sr to improve the collection of X-rays induced by Particle Induced X-ray Em
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a51070523516234c95c76c777bbf6b3c
https://doi.org/10.1016/j.nimb.2019.04.031
https://doi.org/10.1016/j.nimb.2019.04.031
Autor:
Stuart R. Stock, E. Dorryhee, Antonino Miceli, Anthony Kuczewski, Jonathan Almer, Zhong Zhong, John S. Okasinski, D. P. Siddons, T. Krings, D. Pinelli, J. Mead, Sanjit Ghose, Thomas A Caswell, Emerson Vernon, Abdul K. Rumaiz
Publikováno v:
Synchrotron Radiation News. 31:33-38
Germanium has been the material of choice in detectors of high-energy X-rays and gamma rays for many years, largely because it is relatively easy to obtain high-quality material in large quantities...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04c65f4b967aa29f709e40ddd2af826c
https://doi.org/10.1080/08940886.2018.1528432
https://doi.org/10.1080/08940886.2018.1528432
Autor:
Piotr Maj, Farah Fahim, Marcel Trimpl, J. Hoff, Tom Zimmerman, S. Holm, Pawel Grybos, Piotr Kmon, Grzegorz Deptuch, D. P. Siddons
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 65:185-197
An on-chip implementable algorithm for allocation of an X-ray photon imprint, called a hit, to a single pixel in the presence of charge sharing in a highly segmented pixel detector is described. Its proof-of-principle implementation is also given sup
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38950e5fc27908905bc98ea4b5b1d97a
https://doi.org/10.1109/tcsi.2017.2713767
https://doi.org/10.1109/tcsi.2017.2713767
Publikováno v:
2019 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC).
This work was motivated by the possibility of simplifying the process steps on silicon device fabrication. This simplification could benefit other silicon detector fabrications and have the possibility of terminating the junction edges in other detec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dddd3ef50ee8f50723875671716ac7fb
https://doi.org/10.1109/nss/mic42101.2019.9059720
https://doi.org/10.1109/nss/mic42101.2019.9059720
Autor:
Claussen T, Núñez T, Matthias Alfeld, Jan Garrevoet, Kracht T, Chris Ryan, Gerald Falkenberg, Ulrike Boesenberg, D. P. Siddons, R. Kirkham
Publikováno v:
Journal of synchrotron radiation 23(6), 1550-1560 (2016). doi:10.1107/S1600577516015289
Journal of synchrotron radiation 23(6), 1550 - 1560(2016). doi:10.1107/S1600577516015289
The high brilliance of third-generation synchrotron sources increases thedemand for faster detectors to utilize the available flux. The Maia detector is ana
The high brilliance of third-generation synchrotron sources increases thedemand for faster detectors to utilize the available flux. The Maia detector is ana
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0f090389df3c4051e84dc8134ca8919c
https://doi.org/10.1107/s1600577516015289
https://doi.org/10.1107/s1600577516015289
Autor:
Robert Szczygiel, Ron Lipton, S. Holm, Piotr Maj, D. P. Siddons, Pawel Grybos, R.J. Yarema, Robert Patti, Grzegorz Deptuch, Gabriella Carini, Paul Enquist
Publikováno v:
IEEE Transactions on Electron Devices. 63:205-214
The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500- $\mu \text{m}$ -thick silicon sensor, a two-tier 34- $\mu \text{m}$ -thick integrated circuit, and a host printed circuit board (PCB). The integrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fe404d81860a2044a43894a3eb69157
https://doi.org/10.1109/ted.2015.2448671
https://doi.org/10.1109/ted.2015.2448671