Zobrazeno 1 - 4
of 4
pro vyhledávání: '"D. P. Bouldin"'
Publikováno v:
IBM Journal of Research and Development. 39:465-497
Physical phenomena underlying failure due to electromigration and stress-induced voiding in fine Al and Al-alloy thin-film conducting lines are examined in the context of accelerated testing methods and structures. Aspects examined include effects du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60abdd2265fadc3fc64aa1399e997fcd
https://doi.org/10.1147/rd.394.0465
https://doi.org/10.1147/rd.394.0465
Autor:
J. G. Ryan, D. P. Bouldin, Timothy D. Sullivan, D. C. Beyar, George J. Slusser, J. B. Riendeau, S. E. Shore
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 8:1474-1479
Evaporated metallizations composed of aluminum alloys and titanium underlayers were patterned, passivated with plasma enhanced chemical vapor deposited SiNx and aged for 1000 h at 150 °C in order to observe stress‐induced void formation. Metal fil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a595e531e9f10d4ac6e0287264cba555
https://doi.org/10.1116/1.576860
https://doi.org/10.1116/1.576860
Autor:
D. P. Bouldin
Publikováno v:
Journal of Electronic Materials. 10:747-795
With the increasing concern for the affects of alpha particles on the reliability of semiconductor memories, an interest has arisen in characterizing semiconductor manufacturing materials for extremely low-level alpha-emitting contaminants. It is sho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81c82082fe5269e8a2bb498787a4d14c
https://doi.org/10.1007/bf02660131
https://doi.org/10.1007/bf02660131
