Zobrazeno 1 - 10
of 143
pro vyhledávání: '"D. Manessis"'
Autor:
A. Pitilakis, M. Seckel, A.C. Tasolamprou, F. Liu, A. Deltsidis, D. Manessis, A. Ostmann, N.V. Kantartzis, C. Liaskos, C.M. Soukoulis, S.A. Tretyakov, M. Kafesaki, O. Tsilipakos
Metasurfaces (MSs) have been utilized to manipulate different properties of electromagnetic waves. By combining local control over the wave amplitude, phase, and polarization into a single tunable structure, a multi-functional and reconfigurable meta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::39eb70431bb701fe1123ab5cf5492ff5
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:001918-001947
Packages and modules with embedded semiconductor dies are of interest for various application fields and power classes. First packages in the lower power range are available in volume production since almost six years. Recent developments focus on me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b69b90f2176bb4f798af1a7a21b7eb4
https://doi.org/10.4071/2016dpc-tha14
https://doi.org/10.4071/2016dpc-tha14
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000906-000937
Power electronics packaging applications has strong demands regarding reliability and cost. The fields of developments reach from low power converter modules, over single or multichip MOSFET or IGBT packages, up to high power applications, like neede
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4de5035df086f0f7aed734c77ff1208
https://doi.org/10.4071/2015dpc-tp42
https://doi.org/10.4071/2015dpc-tp42
Autor:
M. Bakir, J. Bauwelinck, L. Brusberg, N. Calabretta, K. Christodoulopoulos, C. DeCusatis, S. Dorresteiner, M. Duranton, D. Dutoit, M. Immonen, T. Ishigure, H. Itoh, G.T. Kanellos, A.K. Kodi, K. Kurata, T. Lamprecht, M. Lebby, A. Louri, D. Manessis, S. Menezo, R. Morris, Liam O’Faolain, I. Piacentini, R. Pitwon, S. Ristic, P. Schneider, H. Schröder, T. Shioda, M. Singh, A. Siokis, R. Stabile, Y. Suzuki, K. Takemura, M. Tokushima, D. Tsiokos, T. Vahrenkamp, E. Varvarigos, C. Wan, K. Wang, K. Weidner, J. Wu, H.J. Yan, X. Yin, Y. Zhang, M. Zia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c486a11dfda960fa6d1bce7023c3f41b
https://doi.org/10.1016/b978-0-08-100512-5.00024-3
https://doi.org/10.1016/b978-0-08-100512-5.00024-3
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000694-000719
The spectrum of conventional power electronics packaging reaches from SMD packages for power chips to large power modules. In most of these packages the power semiconductors are connected by bond wires, resulting in large resistances and parasitic in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ecc7e21a76365a1a70938ca5f0c51e1a
https://doi.org/10.4071/2014dpc-tp12
https://doi.org/10.4071/2014dpc-tp12
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001717-001743
The automotive industry has a strong demand for highly reliable and cost-efficient electronics. Especially the upcoming generations of hybrid cars and fully electrical vehicles need compact and efficient 400 V power modules. Within the engine compart
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::716125219364bcc53bb610774bcb90d1
https://doi.org/10.4071/2013dpc-wp35
https://doi.org/10.4071/2013dpc-wp35
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001223-001252
Technology approaches for the embedding of active and passive components using printed circuit board materials and processing gained an increasingly high interest over the last years. The use of such technologies for industrial fabrication has attrac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33e21152e4e419ede68fc5a7cc897424
https://doi.org/10.4071/2012dpc-tp43
https://doi.org/10.4071/2012dpc-tp43
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001019-001045
The continuous miniaturization of silicon dies and the need for a further package size reduction, with an equal or better performance and reduced manufacturing cost, are the main drivers for new packaging concepts. The embedding of active and passive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9ece036c8f76813e559b0967b10f4bc
https://doi.org/10.4071/2011dpc-tp32
https://doi.org/10.4071/2011dpc-tp32
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 7:131-137
The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and by t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c33cdd651a2ce46b43e0beeabd18743a
https://doi.org/10.4071/imaps.261
https://doi.org/10.4071/imaps.261
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