Zobrazeno 1 - 10
of 10
pro vyhledávání: '"D. M. Skala"'
Autor:
John T. Hachman, A. Alec Talin, Daniel H. Morse, Chu-Yeu Peter Yang, D. M. Skala, Joseph T. Ceremuga, Stewart K. Griffiths, Georg Aigeldinger
Publikováno v:
Microsystem Technologies. 14:277-286
Absorption of X-rays in deep X-ray lithography masks can significantly increase exposure time, harden the X-ray spectrum and lead to heating and distortion of the mask. To reduce the impact of such absorption, we have evaluated low atomic mass (low-z
Autor:
D. M. Skala, Stewart K. Griffiths, Nancy Y. C. Yang, Georg Aigeldinger, L L Hunter, Dale R. Boehme, John T. Hachman, Thomas A. Friedmann, Cheryl A. Hauck, P C Y Yang, J S Korellis, Dorrance E. McLean, Matthew W. Losey, Michelle A. Hekmaty, Wei-Yang Lu, James J. Kelly
Publikováno v:
Journal of Micromechanics and Microengineering. 15:1700-1712
Resist substrates used in the LIGA process must provide high initial bond strength between the substrate and resist, little degradation of the bond strength during x-ray exposure, acceptable undercut rates during development and a surface enabling go
Publikováno v:
Microsystem Technologies. 11:379-384
Deep x-ray lithography in combination with electroforming is capable of producing high precision metal parts in small lot series. This study deals with a high aspect ratio structure with overall dimensions on the order of 10 mm × 7 mm × 1.5 mm, wit
Publikováno v:
Journal of Applied Polymer Science. 68:1045-1055
The room-temperature mechanical properties of a closed-cell, polyurethane encapsulant foam were measured as a function of foam density. Over the range of densities examined, the modulus could be described by a power-law relationship with respect to d
Autor:
Chu-Yeu Peter Yang, Wei-Yang Lu, Georg Aigeldinger, Cheryl A. Hauck, John T. Hachman, Michelle A. Hekmaty, James J. Kelly, D. M. Skala, John S. Korellis, Thomas A. Friedmann, Dorrance E. McLean, Luke L. Hunter, Matthew W. Losey, Stewart K. Griffiths, Nancy Y. C. Yang, Dale R. Boehme
Resist substrates used in the LIGA process must provide high initial bond strength between the substrate and resist, little degradation of the bond strength during x-ray exposure, acceptable undercut rates during development, and a surface enabling g
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16ad662c53387182b8df20236c5aa20a
https://doi.org/10.2172/923166
https://doi.org/10.2172/923166
The LIGA spring is a recently designed part for defense program applications. The Sandia California LIGA team has produced an initial group build of these nickel alloy parts. These are distinctive in having a macroscopic lateral size of about 1 cm, w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::875252abd726797cbf7eacc2a8403fa7
https://doi.org/10.2172/921133
https://doi.org/10.2172/921133
Autor:
Alfredo M. Morales, D. M. Skala, Jill M. Hruby, Michelle A. Bankert, Stewart K. Griffiths, Dale R. Boehme, Linda A. Domeier, William D. Bonivert, A. Ting, John T. Hachman
Publikováno v:
SPIE Proceedings.
LIGA, an acronym from the German words for Lithography, Electroforming, and Molding, is being evaluated worldwide as a method to produce microparts from engineering materials. Much of the work to date in LIGA has focused on producing metal microparts
Tension, compression and impact properties of a polyurethane encapsulant foam have been measured as a function of foam density. Significant differences in the behavior of the foam were observed depending on the mode of testing. Over the range of dens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::043a9b7a6a4723fdabc52f90d86d851c
https://doi.org/10.2172/485941
https://doi.org/10.2172/485941
Autor:
S K Griffiths, M W Losey, J T Hachman, D M Skala, L L Hunter, N Y C Yang, D R Boehme, J S Korellis, G Aigeldinger, W Y Lu, J J Kelly, M A Hekmaty, D E McLean, P C Y Yang, C A Hauck and T A Friedmann
Publikováno v:
Journal of Micromechanics & Microengineering; Sep2005, Vol. 15 Issue 9, p1700-1712, 13p
Publikováno v:
Microsystem Technologies; Apr2005, Vol. 11 Issue 4/5, p379-384, 6p