Zobrazeno 1 - 5
of 5
pro vyhledávání: '"D. K. Agnihotri"'
Autor:
D. K. Agnihotri, S. V. S. Chauhan
Publikováno v:
International Journal of Horticultural Science, Vol 13, Iss 4 (2007)
A field experiment was conducted during 2003-2004 and 2004-2005 to study the effect of foliar sprays of ethrel or ethephon (2- chloroethyl phosphonic acid) on pollen sterility and yield parameters in Capsicum annuum var. Pusa jwala. Effect of treatme
Externí odkaz:
https://doaj.org/article/d910610a263d48f08d134e8da31337ee
Autor:
S. V. S. Chauhan, D. K. Agnihotri
Publikováno v:
International Journal of Horticultural Science, Vol 11, Iss 1 (2005)
Efficacy of a popular synthetic detergent, Surf excel in some important vegetable crops viz. Okra or lady finger (Abelmoschus esculentus L.), chilli or red pepper (Capsicum annuum L.) and tomato (Lycopersicon esculentum Mill) was evaluated for induci
Externí odkaz:
https://doaj.org/article/142dcaa971534351b3aba6311d46e03f
Autor:
D. K. Agnihotri, S. V. S. Chauhan
Publikováno v:
International Journal of Horticultural Science, Vol 11, Iss 1 (2005)
Efficacy of a popular synthetic detergent, Surf excel in some important vegetable crops viz. Okra or lady finger (Abelmoschus esculentus L.), chilli or red pepper (Capsicum annuum L.) and tomato (Lycopersicon esculentum Mill) was evaluated for induci
Autor:
C. Wyon, D. K. Agnihotri, J. P. Formica, F. Cacho, Y. Tsach, L. F. Tz. Kwakman, J.‐P. Gonchond, G. Rolland, G. Braeckelmann
Publikováno v:
AIP Conference Proceedings.
X ray reflectivity (XRR) is shown to be well suited to measure the thickness of NiSi films annealed at different temperatures. The phase transformation during the silicide reaction at different spike annealing temperatures (310°C–450°C) has been
In-line Small-Spot X-Ray Fluorescence Assessment of Electroplating and Chemical Mechanical Polishing
Autor:
I. Mazor, A. Tokar, L. Carbonell, Nancy Heylen, J. O’Dell, J. P. Gueneau de Mussy, D. K. Agnihotri, G. Bottiglieri
Publikováno v:
Journal of The Electrochemical Society. 153:G851
In this work we assessed in-line copper thickness evolution on patterned wafers during electroplating (ECD) and chemical mechanical polishing (CMP) steps by means of a novel high-resolution technique based on small-spot X-ray fluorescence ( μ-XRF).