Zobrazeno 1 - 10
of 31
pro vyhledávání: '"D. Gudmundsson"'
Publikováno v:
Clinica Chimica Acta. 493:S581
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::746f14a766a8e4e8e587c860f5213a2e
https://doi.org/10.1016/j.cca.2019.03.1219
https://doi.org/10.1016/j.cca.2019.03.1219
Autor:
Ken Goldberg, D. Gudmundsson
Publikováno v:
Assembly Automation. 27:134-140
Purpose – This paper aims to study a commercially available industrial part feeder that uses an industrial robot arm and computer vision system. Three conveyor belts are arranged to singulate and circulate parts, bringing them under a camera where
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce6a5999be172928a5dae35d5568b308
https://doi.org/10.1108/01445150710733360
https://doi.org/10.1108/01445150710733360
Autor:
D. Gudmundsson, Ken Goldberg
Publikováno v:
ICRA
Scopus-Elsevier
Scopus-Elsevier
We study a programmable robotic part feeder that relies on a sequence of three conveyor belts to separate and re-circulate parts. In industrial practice, belt speeds are set in an ad-hoc fashion. Experience with real feeders reveals that throughput c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b3ed2bed8f91be08f40f68c87a35e73f
https://doi.org/10.1108/01445159910280083
https://doi.org/10.1108/01445159910280083
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 12:44-52
The fabless-foundry partnership for integrated circuit (IC) manufacturing business is expected to grow from 12% in 1995 to approximately 17% (i.e., $45B) of the total IC market in 2000. The growth of this market will be even more significant for subq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::002cb5baebaeef9a43b300f9c2ba9c85
https://doi.org/10.1109/66.744521
https://doi.org/10.1109/66.744521
Autor:
D. Gudmundsson, J.G. Shanthikumar
Publikováno v:
ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005..
Discrete event simulation is used to integrate process and inspection/metrology capacity models. This allows fab yield to be estimated for different process and inspection/metrology capacity choices. The importance of this integration is demonstrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b362e05a755830129d3e272cb065ac49
https://doi.org/10.1109/issm.2005.1513308
https://doi.org/10.1109/issm.2005.1513308
Autor:
J.G. Shanthikumar, D. Gudmundsson
Publikováno v:
ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005..
To help fabs improve their use of inspection tools a practical guide to inspection capacity and sample planning is presented. A comprehensive approach involving data collection, parameter estimation, and model based sample planning is covered. The ob
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba359d68e34209defcc5e4724fe7d626
https://doi.org/10.1109/issm.2005.1513391
https://doi.org/10.1109/issm.2005.1513391
Autor:
Benjamin George Eynon, Carmen Jaehnert, Doris Uhlig, D. Gudmundsson, Kong Son, Kaustuve Bhattacharyya
Publikováno v:
SPIE Proceedings.
Progressive mask defect problems such as crystal growth or haze are key yield limiters for DUV lithography, especially in 300mm fabs. Even if the incoming mask quality is good, there is no guarantee that the mask will remain clean during its producti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0e0527d8ad060467f8a5e724950971e
https://doi.org/10.1117/12.568874
https://doi.org/10.1117/12.568874
Publikováno v:
10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295).
Critical dimension (CD) control in lithography and etch processing is imperative in order to achieve optimum device yield and speed performance for semiconductor manufacturing. As linewidths are reduced, the sources of CD errors do not automatically
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a74b44b2674f944e902fe2f1d89e504
https://doi.org/10.1109/asmc.1999.798202
https://doi.org/10.1109/asmc.1999.798202
Autor:
A. Chatterjee, J.G. Shanthikumar, D. Gudmundsson, R. Williams, Sridhar Seshadri, R.K. Nurani, M. Stoller
Publikováno v:
10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295).
Increasing competition within the semiconductor industry is forcing many manufacturers to consider and implement aggressive cost reduction measures across many operations. In addition, defect inspection steps are often perceived as being "non-value a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3859ec9dd66cd6a20c368e4c82f3558
https://doi.org/10.1109/asmc.1999.798306
https://doi.org/10.1109/asmc.1999.798306
Publikováno v:
1999 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat No.99CH36314).
Increasing fab construction costs, shortening product life cycles, and eroding market prices have become critical realities for today's semiconductor manufacturers. Consequently, many semiconductor facilities are now facing increasing pressure to qui
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7b8bd67c0f00263816872525225c2cf
https://doi.org/10.1109/issm.1999.808734
https://doi.org/10.1109/issm.1999.808734