Zobrazeno 1 - 10
of 44
pro vyhledávání: '"D. B. Knorr"'
Publikováno v:
Journal of Materials Science. 33:4375-4379
The crystallization of thin amorphous TaOx films formed by d.c. reactive sputtering was investigated at temperatures from 500–700 °C. The films remained amorphous for times up to 100 h at 500 °C. The formation of discrete, single crystallites of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d76f738bfec4e3044649cfffc9d4f414
https://doi.org/10.1023/a:1004484915386
https://doi.org/10.1023/a:1004484915386
Publikováno v:
Fatigue & Fracture of Engineering Materials and Structures. 19:1339-1355
The α 2 +β alloy Ti-24 at%Al-11at%Nb was evaluated for mechanical properties in the as-received, mill annealed condition (nearly equiaxed) and in the β annealed condition (basketweave). The as-received condition had a moderately strong basal trans
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a829108c02a561c1c625ef3817c8f71
https://doi.org/10.1111/j.1460-2695.1996.tb00171.x
https://doi.org/10.1111/j.1460-2695.1996.tb00171.x
Autor:
D. B. Knorr, Kenneth P. Rodbell
Publikováno v:
Journal of Applied Physics. 79:2409-2417
The effects of microstructure on electromigration behavior were evaluated in three nominally 1 μm thick pure aluminum films, which were tested at temperatures from 423 to 523 K. The three Al films had essentially the same grain structure but differe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d20f7ee74e2a10d392ff56edad12dca
https://doi.org/10.1063/1.361168
https://doi.org/10.1063/1.361168
Publikováno v:
Materials Science Forum. :423-430
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88bace298b0992f8170e8df1f6427092
https://doi.org/10.4028/www.scientific.net/msf.204-206.423
https://doi.org/10.4028/www.scientific.net/msf.204-206.423
Publikováno v:
Canadian Metallurgical Quarterly. 34:287-292
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::950a64ef32d1127b3fff0e51f5626808
https://doi.org/10.1179/cmq.1995.34.3.287
https://doi.org/10.1179/cmq.1995.34.3.287
Autor:
D. B. Knorr
Publikováno v:
JOM. 47:27-30
Leading-edge packaging applications are demanding some combination of greater interconnect density, smaller size, higher system performance, and lower cost. The elimination of the chip-level package in favor of the direct attachment of chips to a sub
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ceb3d6edb4fd82b061f89d66befa2f2b
https://doi.org/10.1007/bf03221200
https://doi.org/10.1007/bf03221200
Publikováno v:
Journal of Applied Physics. 76:2671-2680
The effects of thin Ti, TiN, or Ti/TiN underlayers on the development of the crystallographic texture and the grain structure are explored. Metal layers ∼0.5 μm in thickness of Al‐0.5Cu or of Cu are deposited on these underlayers and on amorphou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::676c4bbb993b592a754e211524990247
https://doi.org/10.1063/1.357564
https://doi.org/10.1063/1.357564
Autor:
Jerzy A. Szpunar, D. B. Knorr
Publikováno v:
JOM. 46:42-48
Thin films are important in a variety of applications, including optical, magnetic,and electronic devices. The origin of microstructure in films formed by physical vapor deposition depends primarily on the homologous deposition temperature, which det
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::253f62a78f506b36eaae9ea1ba97a233
https://doi.org/10.1007/bf03222582
https://doi.org/10.1007/bf03222582
Publikováno v:
JOM. 46:32-36
Textures in materials have been studied extensively since the 1930s following the pioneering work of Wassermann.1,2 The modern era of texture measurement started in 1949 with the development of the x-ray pole figure technique for texture measurement
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40e89f91905c3abb8b9a77a3c8d48270
https://doi.org/10.1007/bf03222580
https://doi.org/10.1007/bf03222580
Publikováno v:
Journal of Electronic Materials. 23:611-617
The effects of isothermal aging on the microstructure and mechanical behavior of Sn-Bi/Cu solder joints are reported. Lap shear solder joints of eutectic Sn-Bi solder were aged for 3 to 30 days at 80°C and then loaded to failure in shear. Changes in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63edcc270e66978217c180b3a24bdc79
https://doi.org/10.1007/bf02653346
https://doi.org/10.1007/bf02653346