Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Dániel Straubinger"'
Publikováno v:
Micromachines, Vol 15, Iss 6, p 743 (2024)
The technology to jet print metal lines with precise shape fidelity on diverse substrates is gaining higher interest across multiple research fields. It finds applications in additively manufactured flexible electronics, environmentally friendly and
Externí odkaz:
https://doaj.org/article/96fe0da3298944679877f2f654d23a1f
Publikováno v:
Journal of Materials Research and Technology, Vol 21, Iss , Pp 308-318 (2022)
This paper presents the effect of electromigration and isothermal ageing in lead-free SAC305 (Sn3Ag0.5Cu) solder joints of chip-size surface mounted (SMD) components, where different track-to-pad joining angles define the current density in the joint
Externí odkaz:
https://doaj.org/article/9a0015f6f7834a0ba518488cfaf834c6
Publikováno v:
Case Studies in Thermal Engineering, Vol 33, Iss , Pp 102001- (2022)
In this paper, the effect of different thermocouple constructions on the hot spot temperature are investigated with a modelling approach to achieve more precise soldering profile acquisition and failure analysis at different reflow soldering heat tra
Externí odkaz:
https://doaj.org/article/5703b20e64a841e7a5889448ab04be54
Autor:
Agata Skwarek, Olivér Krammer, Tamás Hurtony, Przemysław Ptak, Krzysztof Górecki, Sebastian Wroński, Dániel Straubinger, Krzysztof Witek, Balázs Illés
Publikováno v:
Nanomaterials, Vol 11, Iss 6, p 1545 (2021)
The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void
Externí odkaz:
https://doaj.org/article/2fa994db43b84114bd64042a711f3351
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0f2686e95bbda4e7d24abd0bc6f065fe
https://doi.org/10.2139/ssrn.3972769
https://doi.org/10.2139/ssrn.3972769