Zobrazeno 1 - 1
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pro vyhledávání: '"Cut-off grinding force"'
Publikováno v:
九州大学工学紀要. 63(1):67-78
Machining a brittle material blank into a final product, cut-off grinding process, i.e. slicing process producing the wafers from silicon ingot or dicing process dividing the wafer into chips, is one of the important machining methods. The present re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=jairo_______::c737fba2ac3c4aa08af30da78cea1d68
http://hdl.handle.net/2324/1128
http://hdl.handle.net/2324/1128
