Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Curtis Zwenger"'
Publikováno v:
International Symposium on Microelectronics. 2021:000207-000211
Increasing demands for storage and high-performance memory in applications such as artificial intelligence (AI), machine learning and processing storage are driving long-term growth in the market. This paper will highlight the key challenges encounte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3d5c4a859467df8ccd1cb1aea9cf93e
https://doi.org/10.4071/1085-8024-2021.1.000207
https://doi.org/10.4071/1085-8024-2021.1.000207
Autor:
KiYeul Yang, Nathan Whitchurch, Michael G. Kelly, Curtis Zwenger, George J. Scott, TaeKyeong Hwang, WonMyoung Ki, JongHyun Jeon, JaeHun Bae
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
As the costs of advanced node silicon have risen sharply with the 7 and 5-nanometer nodes, advanced packaging is coming to a crossroad where it is no longer fiscally prudent to pack all desired functionality into a single die. While single-die packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f8fc9cf35c1f1a5a48418753c05f7ca
https://doi.org/10.1109/ectc32862.2020.00145
https://doi.org/10.1109/ectc32862.2020.00145
Autor:
Curtis Zwenger, Ron Huemoeller
Publikováno v:
Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies
The continued scaling of transistor geometries for semiconductor devices has been placing an increased demand on the next‐level interconnect technologies. A new, innovative chip‐last high density fan‐out (HD‐FO) structure called Silicon Wafer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6f1715e84786b295542be814cb5a6a4
https://doi.org/10.1002/9781119313991.ch7
https://doi.org/10.1002/9781119313991.ch7
Autor:
InSu Mok, Curtis Zwenger, Moh Kolbehdari, IlBok Lee, Alex Copia, WonChul Do, Kang-Wook Lee, Wongeol Lee, Suresh Jayaraman, WonMyoung Ki
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Fan-out wafer level packaging (FOWLP) is one of the latest technologies to meet the requirements of high performance and thin form-factor, especially for mobile application processors. To achieve a simple path way and thinner package form, many outso
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ba204afcca55ef029be9dab43a68c11
https://doi.org/10.1109/ectc.2018.00092
https://doi.org/10.1109/ectc.2018.00092
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000217-000247
The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::362cfcf292f221e106d76bcaa73e160e
https://doi.org/10.4071/2015dpc-ta22
https://doi.org/10.4071/2015dpc-ta22
Autor:
Curtis Zwenger, JiHun Yi, WonChul Do, Bora Baloglu, Michael G. Kelly, Wongeol Lee, George J. Scott
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
The tremendous growth in smartphones and tablets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of integrated circuit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3fe9982e99c8689cf4ae2362091a2f6
https://doi.org/10.1109/ectc.2017.321
https://doi.org/10.1109/ectc.2017.321
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001486-001519
The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69cc355904652d7a5f3aa242c7db1635
https://doi.org/10.4071/2013dpc-wp23
https://doi.org/10.4071/2013dpc-wp23
Autor:
Curtis Zwenger, Shawn O'Connor, Min Yoo, C. Beddingfield, Robert Lanzone, KyungRok Park, DaeByoung Kang, Mark A. Gerber, Robert Francis Darveaux, Sung-Su Park, MinJae Lee
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
There has been a growing need for fine pitch flip chip technology in support of next generation communication devices with increasing die complexities. The increase in functionality which drives a larger number of signal I/O's in combination with sma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::668c0cff4c96ac0b6290307c87ea8358
https://doi.org/10.1109/ectc.2011.5898576
https://doi.org/10.1109/ectc.2011.5898576
Autor:
Choonheung Lee, DaeByoung Kang, Min Yoo, Jihee Cho, Robert Lanzone, Jaedong Kim, Curtis Zwenger, MinJae Lee, Seungki Lee
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Today, flip chip technology is a main stream of interconnection in microelectronic packaging and market forces continue to drive toward finer pitch interconnections. In this paper, fine pitch flip chip (FPFC) interconnection technology (i.e., less th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0ef4cfacc8be25c4b71fe0919dade63
https://doi.org/10.1109/ectc.2009.5074092
https://doi.org/10.1109/ectc.2009.5074092
Autor:
DaeByoung Kang, Jaedong Kim, Christopher M. Scanlan, Dongjoo Park, Lee J. Smith, Choonheung Lee, Tae-Kyung Hwang, Kwang Ho Kim, Curtis Zwenger, Jinseong Kim, Mahmoud Dreiza, Robert Francis Darveaux, Christopher J. Berry, Kiwook Lee
Publikováno v:
2008 58th Electronic Components and Technology Conference.
In recent years, package-on-package (PoP) has been rapidly adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. However, existing methods of making the PoP base package may not satisfy next gene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf005bc3dd80f79ecc84d5099a2a5d1e
https://doi.org/10.1109/ectc.2008.4550110
https://doi.org/10.1109/ectc.2008.4550110