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pro vyhledávání: '"Cunli Wu"'
Publikováno v:
Particles on Surfaces: Detection, Adhesion and Removal, Volume 7 ISBN: 9780429070716
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7eeb661d655964990548aa3d3881328
https://doi.org/10.1201/9780429070716-21
https://doi.org/10.1201/9780429070716-21
Publikováno v:
Composite Structures. 279:114711
With the development of composite processing technology, three-dimensional braided composites have been widely used in automotive, aerospace and other high-tech industries. Due to specific yarn distribution in microstructure, three-dimensional braide
Publikováno v:
Computational Mechanics. Feb2005, Vol. 35 Issue 2, p85-93. 9p.
Publikováno v:
Aerospace Science and Technology. 11:518-526
The effects of parameter uncertainty on the flutter characteristics of a two-dimensional airfoil in an incompressible flow were investigated through Gegenbauer polynomial approximation. The uncertain parameters, such as the linear and cubic pitch sti
Publikováno v:
Chaos, Solitons & Fractals. 32:1201-1207
This paper addresses chaos synchronization of two identical stochastic Duffing oscillators with bounded random parameters subject to harmonic excitations. In the analysis the stochastic Duffing oscillator is first transformed into an equivalent deter
Publikováno v:
Chaos, Solitons & Fractals. 27:459-469
Stochastic chaos discussed here means a kind of chaotic responses in a Duffing oscillator with bounded random parameters under harmonic excitations. A system with random parameters is usually called a stochastic system. The modifier ‘stochastic’
Publikováno v:
Computational Mechanics. 35:85-93
The influence of a specified damage on transient propagation of Lamb wave in a composite laminated plate is studied by finite element analysis. The finite element formulation is developed for the laminated plate with embedded or surface-bonded piezoe
Publikováno v:
Key Engineering Materials. :51-56
Publikováno v:
On the Recent Advances of the Ultrasonic Nondestructive Evaluation and Composite Material Characterization.
The removal of particles from elastic substrates has been an important practical problem in the electronics industry especially as the sizes of electronic units shrink. In recent years, there has been an interest in removingsubmicron level particles