Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Cun Ji Pu"'
Autor:
Yan Zhi Peng, Cai Ju Li, Jiao Jiao Yang, Jia Tao Zhang, Ju Bo Peng, Guang Ji Zhou, Cun Ji Pu, Jian Hong Yi
Publikováno v:
Metals, Vol 11, Iss 4, p 538 (2021)
In electronic packaging, Sn-Zn lead-free solder has great application prospects. Sn-9Zn-xBi alloys were obtained by smelting. This paper details a systematic study of the effect of Bi on the microstructure, melting behavior, wettability, mechanical b
Externí odkaz:
https://doaj.org/article/cbb3e46d12ae49ad8d2a32bdff7e6b71
Autor:
Cun Ji Pu, Jian Hong Yi, Jiao Jiao Yang, Jia Tao Zhang, Yan Zhi Peng, Guang Ji Zhou, Ju Bo Peng, Li Caiju
Publikováno v:
Metals, Vol 11, Iss 538, p 538 (2021)
Metals
Volume 11
Issue 4
Metals
Volume 11
Issue 4
In electronic packaging, Sn-Zn lead-free solder has great application prospects. Sn-9Zn-xBi alloys were obtained by smelting. This paper details a systematic study of the effect of Bi on the microstructure, melting behavior, wettability, mechanical b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bde4cd1261ef8045ce45a5f8dd18d0e7
https://doi.org/10.3390/met11040538
https://doi.org/10.3390/met11040538