Výsledky vyhledávání - "Cu metallization"

Akademický článek

Improvement of AlGaN/GaN HEMT Noise Figure Using Thick Cu Metallization for Satellite Communication Applications

Autor: Howie Tseng, Yueh-Chin Lin, Chieh Cheng, Po-Wei Chen, Heng-Tung Hsu, Yi-Fan Tsao, Edward Yi Chang

Publikováno v: IEEE Journal of the Electron Devices Society, Vol 12, Pp 268-274 (2024)

In this study, AlGaN/GaN high-electron-mobility-transistor (HEMT) with thick Cu metallization is investigated, and the Radio Frequency (RF) performance and the reliability are analyzed. By applying thick Cu metallization of $6.0 ~\mu \text{m}$ as int

Externí odkaz: https://doaj.org/article/82a72b4f519240c1b0f2654aa4860ff0

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Akademický článek

TOPCon Solar Cells With Al-Free Ag and Cu Metallization

Autor: Jan Lossen, Pirmin Preis, Mertcan Comak, Joris Libal, Dominik Rudolph, Jan Hoß, Lejo Joseph Koduvelikulathu

Publikováno v: SiliconPV Conference Proceedings, Vol 2 (2024)

This work presents an approach to lower the silver consumption of screen printed TOPCon (Tunnel Oxide Passivated Contact) solar cells by reducing and partially replacing the silver by low cost copper metallization paste. On the solar cells front side

Externí odkaz: https://doaj.org/article/a7020b1b98b645dc9e80624f4e8a8cb3

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