A Cold Atmospheric Pressure Plasma Discharge Device Exerts Antimicrobial Effects

Autor: Cornell, Kenneth A., Benfield, Kate, Berntsen, Tiffany, Clingerman, Jenna, Croteau, Adam, Goering, Spencer, Moyer, Daniel, Provost, Mariah, White, Amanda, Plumlee, Don, Oxford, Julia T., Browning, Jim

A cold atmospheric pressure plasma device was developed using two parallel plates of Low Temperature Co-fired Ceramic with embedded electrodes. The 2.4 cm wide by 1 mm deep plasma discharge operates at 20 kHz with a 2–5 kV AC drive signal across a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=pmid________::0f4960c550ef21f28d1f7295183cdc0e
https://europepmc.org/articles/PMC7098701/

A Cold Atmospheric Pressure Plasma Discharge Device Exerts Antimicrobial Effects.

Autor: Cornell KA; Department of Chemistry and Biochemistry, Boise State University, Boise, ID USA., Benfield K; Department of Mechanical and Biomedical Engineering, Boise State University, Boise, ID USA., Berntsen T; Department of Electrical and Computer Engineering, Boise State University, Boise, ID USA., Clingerman J; Department of Chemistry and Biochemistry, Boise State University, Boise, ID USA., Croteau A; Department of Electrical and Computer Engineering, Boise State University, Boise, ID USA., Goering S; Department of Chemistry and Biochemistry, Boise State University, Boise, ID USA., Moyer D; Department of Chemistry and Biochemistry, Boise State University, Boise, ID USA., Provost M; Department of Chemistry and Biochemistry, Boise State University, Boise, ID USA., White A; Department of Mechanical and Biomedical Engineering, Boise State University, Boise, ID USA., Plumlee D; Department of Mechanical and Biomedical Engineering, Boise State University, Boise, ID USA., Oxford JT; Department of Biological Science, Boise State University, Boise, ID USA., Browning J; Department of Electrical and Computer Engineering, Boise State University, Boise, ID USA.

Publikováno v: International journal of latest trends in engineering & technology : IJLTET [Int J Latest Trends Eng Technol] 2020 Jan; Vol. 15 (3), pp. 036-41.