Zobrazeno 1 - 10
of 57
pro vyhledávání: '"Cristina Andersson"'
Autor:
Göran Wetter, Per-Erik Tegehall, Johan Liu, Dag Andersson, Bart Vandevelde, Cristina Andersson, C. Noritake, Peng Sun
Publikováno v:
Soldering & Surface Mount Technology. 21:28-38
PurposeThe purpose of this paper is to assess the effect of different temperature cycling profiles on the reliability of lead‐free 388 plastic ball grid array (PBGA) packages and to deeply understand crack initiation and propagation.Design/methodol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::258fec3b932faacac4a87480fc2fc565
https://doi.org/10.1108/09540910910947453
https://doi.org/10.1108/09540910910947453
Publikováno v:
Soldering & Surface Mount Technology. 21:9-13
PurposeThe purpose of this paper is to study the melting temperature of the nanoparticles of the new developed Sn‐0.4Co‐0.7Cu (wt%) lead‐free solder alloy.Design/methodology/approachNanoparticles of Sn‐0.4Co‐0.7Cu lead‐free solder alloy w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7eb9de39a6e2071e5fb4ea22e17d3e4
https://doi.org/10.1108/09540910910947417
https://doi.org/10.1108/09540910910947417
Autor:
Dan Kuylenstierna, James E. Morris, Peng Cai, Herbert Zirath, Cristina Andersson, Xia Zhang, Johan Liu
Publikováno v:
Journal of Infrared, Millimeter, and Terahertz Waves. 30:183-189
In this paper, the authors propose a novel and compact 50-70 GHz planar microstrip bandpass filter, possessing sharp-rejection, low insertion-loss and wide-band characteristics, based on Liquid Crystal Polymer (LCP) substrates. The filter is fabricat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18198b4bd7d2754a654fea6d10dc01a8
https://doi.org/10.1007/s10762-008-9435-9
https://doi.org/10.1007/s10762-008-9435-9
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Publikováno v:
Journal of Electronic Materials. 38:351-355
Due to the toxicity of lead (Pb), Pb-containing solder alloys are being phased out from the electronics industry. This has lead to the development and implementation of lead-free solders. Being an environmentally compatible material, the lead-free Sn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0ca67fb3b2e66aadb34a4c1666812aa
https://doi.org/10.1007/s11664-008-0591-4
https://doi.org/10.1007/s11664-008-0591-4
Publikováno v:
Journal of Alloys and Compounds. 457:97-105
The ternary Sn–Cu–Co system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology and it was found to be 0.4% Co and 0.7% Cu (wt%) with a melting point of 224 ◦C. The tensile behavior of this alloy was
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d021960e69b9467faf6685aa8832421
https://doi.org/10.1016/j.jallcom.2007.03.028
https://doi.org/10.1016/j.jallcom.2007.03.028
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 31:331-344
Temperature cycling of electronic components was carried out at two different temperature profiles, the first ranging between -55degC and 100degC (TC1) and the second between 0degC and 100degC (TC2). Totally, 7000 cycles were run at TC1 and 14500cycl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49e6bc1dad422e341435e074128816d1
https://doi.org/10.1109/tcapt.2008.916793
https://doi.org/10.1109/tcapt.2008.916793
Publikováno v:
Journal of Alloys and Compounds. 437:169-179
In this paper, the coupling effect in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu–Sn compound
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e66d630715ee7a988408cc6a4cf9585
https://doi.org/10.1016/j.jallcom.2006.07.121
https://doi.org/10.1016/j.jallcom.2006.07.121
Publikováno v:
Microelectronics Reliability. 47:266-272
Temperature cycling of a test board with different electronic components was carried out at two different temperature profiles in a single-chamber climate cabinet. The first temperature profile ranged between 55 and 100 C and the second between 0 and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d209c4b47fa226f7cc9084dcc6949e6
https://doi.org/10.1016/j.microrel.2006.09.014
https://doi.org/10.1016/j.microrel.2006.09.014
Autor:
Xicheng Wei, Dongkai Shangguan, Zhaonian Cheng, Peng Sun, Zonghe Lai, Johan Liu, Cristina Andersson
Publikováno v:
Journal of Alloys and Compounds. 425:191-199
The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-immersion Au metallization exhibited different interfacial morphology after high temperature storage (HTS) testing at 150/spl deg/C. Ni/sub 3/Sn/sub 4/ intermetallic compounds (IMCs) were foun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::310e1da66e705bea19a67929eeca77e9
https://doi.org/10.1016/j.jallcom.2006.01.080
https://doi.org/10.1016/j.jallcom.2006.01.080
Publikováno v:
Materials Science and Engineering: B. 135:134-140
The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260 °C for 2 min. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d460e3f618da703b30c31fce217e6e0
https://doi.org/10.1016/j.mseb.2006.08.051
https://doi.org/10.1016/j.mseb.2006.08.051