Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Craig Hesling"'
Autor:
Anh Luong, Khushboo Bhatia, Anthony Rowe, Swarun Kumar, Craig Hesling, Adwait Dongare, Artur Balanuta, Bob Iannucci
Publikováno v:
IPSN
In this demonstration, we present OpenChirp, an open-source Low-Power Wide Area Networking (LPWAN) infrastructure. OpenChirp is a management framework that provides data context, storage, visualization, and access control over the web. At the physica
Autor:
Craig Hesling, Le Tran, Jonathan Francis, Anthony Rowe, Sirajum Munir, Ripudaman Singh Arora, Anand Krishnan Prakash, Matias Quintana, Charles Shelton, Mario Berges
Publikováno v:
BuildSys@SenSys
Occupancy estimation is very useful for a wide range of smart building applications including energy efficiency, safety, and security. In this demonstration, we present a novel solution called FORK, which uses a Kinect depth sensor for estimating occ
Autor:
Charles Shelton, Craig Hesling, Christopher Martin, Jonathan Francis, Juncheng Li, Ripudaman Singh Arora, Anthony Rowe, Sirajum Munir, Mario Berges
Publikováno v:
RTAS
Occupancy estimation is an important primitive for a wide range of applications including building energy efficiency, safety, and security. In this paper, we explore the potential of using depth sensors to detect, estimate, identify, and track occupa
Autor:
Adwait Dongare, Bob Iannucci, Artur Balanuta, Ricardo Lopes Pereira, Anthony Rowe, Craig Hesling, Khushboo Bhatia
Publikováno v:
PerCom Workshops
Infrastructure monitoring applications currently lack a cost-effective and reliable solution for supporting the last communication hop for low-power devices. The use of cellular infrastructure requires contracts and complex radios that are often too
Publikováno v:
ACM Transactions on Sensor Networks; Nov2022, Vol. 18 Issue 4, p1-44, 44p
Publikováno v:
ACM Transactions on Sensor Networks; Sep2021, Vol. 17 Issue 4, p1-28, 28p
Publikováno v:
MobiCom: International Conference on Mobile Computing & Networking; 2019, p1-17, 17p
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Nov2017, Vol. 263 Issue 5, p1-1, 1p