Process variation monitoring (PVM) by wafer inspection tool as a complementary method to CD-SEM for mapping LER and defect density on production wafers.

Autor: Shabtay, Saar, Blumberg, Yuval, Levi, Shimon, Greenberg, Gadi, Harel, Daniel, Conley, Amiad, Meshulach, Doron, Kan, Kobi, Dolev, Ido, Kumar, Surender, Mendel, Kalia, Goto, Kaori, Yamaguchi, Naoaki, Iriuchijima, Yasuhiro, Nakamura, Shinichi, Nagaoka, Shirou, Sekito, Toshiyuki

Publikováno v: Proceedings of SPIE; Nov2009 Part 2, Issue 1, p72720O-72720O-10, 10p

Challenges of 29nm half-pitch NAND Flash STI patterning with 193nm dry lithography and self-aligned double patterning.

Autor: Chiu, M. C., Lin, Benjamin Szu-Min, Tsai, M. F., Chang, Y. S., Yeh, M. H., Ying, T. H., Ngai, Chris, Jin, Jaklyn, Yuen, Stephen, Huang, Sem, Chen, Yongmei, Miao, Liyan, Tai, Kevin, Conley, Amiad, Liu, Ian

Publikováno v: Proceedings of SPIE; Nov2008, Issue 1, p714021-714021-8, 8p

Pseudo Epi—Cost Reduction Approach and a Paradigm Shift in Substrate Material.

Autor: Aminzadeh, Mehran, Ravi, K.V., Sery, George E., Conley, Amiad, Casperson, Matt

Publikováno v: IEEE Transactions on Semiconductor Manufacturing; Nov2002, Vol. 15 Issue 4, p486, 7p, 7 Black and White Photographs, 1 Diagram, 2 Charts, 9 Graphs