Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Congfu FANG"'
Publikováno v:
Lubricants, Vol 12, Iss 10, p 333 (2024)
Cutting fluid can improve the heat dissipation and lubrication in the cutting process and thus increase the machining quality. In this work, a pollution-free alcohol solution was proposed as the cutting fluid in an ultra-precision cutting process to
Externí odkaz:
https://doaj.org/article/1b88a73acc9d443586de31dfe1094850
Autor:
Hongyang LI, Congfu FANG
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 43, Iss 2, Pp 188-195 (2023)
Diamond tools are widely used in grinding, wire sawing and other fields. The characteristics of abrasive particles on the surface are an important factor affecting the machining results and tool performance. To process abrasive grain images with comp
Externí odkaz:
https://doaj.org/article/e31b4fb2a2d742049757fcbf1ef121ee
Publikováno v:
Micromachines, Vol 13, Iss 12, p 2147 (2022)
The single-point diamond-turning operation is a commonly used method for ultra-precision machining of various non-ferrous materials. In this paper, a magnetic field was introduced into a single-point diamond-turning system, and magnetic-field-assiste
Externí odkaz:
https://doaj.org/article/c0bb06cbba394ff98a3e7a6a27258dc3
Publikováno v:
Crystals, Vol 10, Iss 4, p 293 (2020)
Sapphire lapping is of key importance for the successful planarization of wafers that are widely present in electronic devices. However, the high hardness of sapphire makes it extremely challenging to improve its material removal rate during the lapp
Externí odkaz:
https://doaj.org/article/779f63fcbdbb4c93ab798ddc49d20cdf
Autor:
Kai Zeng, Xian Wu, Feng Jiang, Congfu Fang, Laifa Zhu, Jinxian Zhang, Mingsheng Wang, Chao Liu
Publikováno v:
Journal of Manufacturing Processes. 90:43-53
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2362543eeabd5a32eeb4d51c868ad704
https://doi.org/10.1016/j.jmapro.2023.01.080
https://doi.org/10.1016/j.jmapro.2023.01.080
Publikováno v:
Mechanical Sciences, Vol 12, Pp 97-108 (2021)
Lapping and polishing technology is an efficient processing method for wafer planarization processing. The structure of the fixed abrasive pad (FAP) is one of the most concerning issues in the research. The FAP structure affects the pressure distribu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3f55ddf2205b24550f742338695e0ee4
https://ms.copernicus.org/articles/12/97/2021/ms-12-97-2021.pdf
https://ms.copernicus.org/articles/12/97/2021/ms-12-97-2021.pdf
Publikováno v:
Journal of Manufacturing Processes. 50:653-662
Uniform wear of lapping wheel helps to improve the surface accuracy of workpiece and increase the lifespan of wheel in double-sided lapping. The relative motion of workpiece has a significant effect on wear uniformity of the lapping wheel. In this pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45df88df0eb7eb4b5d4864195993c095
https://doi.org/10.1016/j.jmapro.2020.01.001
https://doi.org/10.1016/j.jmapro.2020.01.001
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 32:352-358
In the process of double-sided lapping, the surface shape of the lapping wheel changes because of uneven wear, which affects the quality of the workpiece, especially the surface shape accuracy of the workpiece (bow, warp, and total thickness variance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a347206ae12cd68c202c3e45ba4aebab
https://doi.org/10.1109/tsm.2019.2912454
https://doi.org/10.1109/tsm.2019.2912454
Publikováno v:
Journal of Physics: Conference Series. 2289:012023
Diamond images have characteristics of adhesive abrasives besides much background noise, irregular abrasive shapes and different abrasive size, which brings big challenges to accurate diamond abrasive detection. Therefore, an improved watershed algor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ecfc576224bebb1d50b9feaa8e92350a
https://doi.org/10.1088/1742-6596/2289/1/012023
https://doi.org/10.1088/1742-6596/2289/1/012023
Publikováno v:
Ceramics International. 44:12774-12782
This paper aimed to investigate the grinding characterizations and mechanism of the 0°/90° orthogonal structure surface of the 2D–Cf/C–SiC composites under different grinding fiber angles (the angle between the grinding direction and the fiber
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c33914786d43afc57ca58fec883bf8b0
https://doi.org/10.1016/j.ceramint.2018.04.083
https://doi.org/10.1016/j.ceramint.2018.04.083