Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Cong Hiep Hoang"'
Autor:
Cong Hiep Hoang, Arad Azizi, Najmeh Fallahtafti, Srikanth Rangarajan, Vahideh Radmard, Charles Arvin, Kamal Sikka, Scott Schiffres, Bahgat Sammakia
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1091-1099
Autor:
Ghazal Mohsenian, Srikanth Rangarajan, Bahgat Sammakia, Scott N. Schiffres, Leila Choobineh, Mohammad I. Tradat, Cong Hiep Hoang, Yaman M. Manaserh, Alfonso Ortega
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1565-1582
In this review, the heat transfer characteristics of several pumped two-phase electronic cooling technologies are quantitatively examined and compared on the basis of heat flux, coolant temperatures, heat source area, base temperature, and coolant ty
Autor:
Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Publikováno v:
Journal of Electronic Packaging. 144
The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types of ITE, each having its phy
Autor:
Bahgat Sammakia, Cong Hiep Hoang, Najmeh Fallahtafti, Vahideh Radmard, Leila Choobineh, Yaser Hadad, Paul R. Chiarot
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1304-1319
Optimization of liquid-cooled heatsinks (cold plates) is of critical importance due to their widespread application in high-performance electronic packages consisting of heterogeneous integrated systems, field programmable gate arrays (FPGAs), and on
Autor:
Najmeh Fallahtafti, Srikanth Rangarajan, Yaser Hadad, Charles Arvin, Kamal Sikka, Cong Hiep Hoang, Ghazal Mohsenian, Vahideh Radmard, Scott Schiffres, Bahgat Sammakia
Publikováno v:
International Journal of Heat and Mass Transfer. 192:122897
Autor:
Yaman M. Manaserh, Bharath Ramakrisnan, Yaser Hadad, Srikanth Rangarajan, Bahgat Sammakia, Scott N. Schiffres, Cong Hiep Hoang, Mohammad I. Tradat
The miniaturization of microelectronic devices and an increasing demand for faster computing results in high heat flux applications. By adopting direct liquid cooling, the high heat flux and high-power demands can be met. In this paper, thermo-hydrau
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30d0eaeff3c5f652e563ee8fd4d65be8
https://doi.org/10.1115/1.0003630v
https://doi.org/10.1115/1.0003630v
Autor:
Scott N. Schiffres, Bahgat Sammakia, Arad Azizi, Srikanth Rangarajan, Kourosh Nemati, Ghazal Mohsenian, Cong Hiep Hoang, Vahideh Radmard, Najmeh Fallahtafti
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
As heterogeneous integration evolves, the diversity and density of devices that combine multiple functionalities has significantly increased. The subsequent increase in power usage and reduced size of components, specifically of Central Processing Un
Autor:
Scott N. Schiffres, Najmeh Fallahtafti, Srikanth Rangarajan, Cong Hiep Hoang, Mohammad I. Tradat, Vahideh Radmard, Charles L. Arvin, Bahgat Sammakia
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
This paper focuses on two-phase flow boiling of dielectric coolant HFE 7000 inside a copper multi-microchannel heat sink for high heat flux chip applications. The heat sink is composed of parallel microchannels, 200 µm wide, 2500 µm high, and 20 mm
Akademický článek
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Autor:
Sadegh Khalili, Yaser Hadad, Bahgat Sammakia, Cong Hiep Hoang, Arvind Pattamatta, Bharath Ramakrishnan, Srikanth Rangarajan
Publikováno v:
Journal of Electronic Packaging. 143
High-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling heat transfer technique is wi