Zobrazeno 1 - 10 of 1 892 pro vyhledávání: '"Conductive films"'
1
Akademický článek
A STUDY OF TIME EVOLUTION OF SOME COSMOLOGICAL PARAMETERS IN THE FRAMEWORK OF AN ANISOTROPIC KALUZA-KLEIN METRIC USING AN EMPIRICAL EXPONENTIAL SCALE FACTOR.
Autor: Roy, Sudipto1 roy.sudipto@sxccal.edu
Publikováno v: East European Journal of Physics. 2024, Issue 3, p83-92. 10p.
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2
Akademický článek
Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.
Autor: Fang, Yexing1 (AUTHOR), Wang, Taiyu1 (AUTHOR), Gu, Yue2 (AUTHOR) y.gu@yale.edu, Yang, Mingkun1 (AUTHOR), Li, Hong1 (AUTHOR), Shi, Sujun1 (AUTHOR), Zhao, Xiuchen1 (AUTHOR), Huo, Yongjun1 (AUTHOR) y.gu@yale.edu
Publikováno v: Materials (1996-1944). Apr2024, Vol. 17 Issue 7, p1658. 17p.
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3
Akademický článek
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly.
Autor: Pan, Yan1 (AUTHOR) yan.pan@siat.ac.cn, Zhang, Shuye2 (AUTHOR) syzhang@hit.edu.cn, Zhu, Pengli1 (AUTHOR) pl.zhu@siat.ac.cn, Paik, Kyung W.3 (AUTHOR) kwpaik@kaist.ac.kr
Publikováno v: Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 5, p253-259. 7p.
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4
Akademický článek
Anisotropic conductive film (ACF) step-by-step line ablation using NIR, green, and DUV wavelengths femtosecond laser for Micro-LED display repair.
Autor: Choi, Junha1,2 (AUTHOR), Cho, Sung-Hak1,2 (AUTHOR) shcho@kimm.re.kr
Publikováno v: Applied Physics A: Materials Science & Processing. Sep2024, Vol. 130 Issue 9, p1-10. 10p.
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5
Akademický článek
Stretchable Anisotropic Conductive Film with Position‐Registered Conductive Microparticles Used for Strain‐Insensitive Ionic Interfacing in Stretchable Ionic Sensors.
Autor: Park, Doowon1 (AUTHOR), Kwak, Hyunsu2 (AUTHOR), Kim, Seonghyeon2 (AUTHOR), Choi, Hyeongseok1 (AUTHOR), Lim, Ighyun1 (AUTHOR), Kwak, Mingyu1 (AUTHOR), Kim, Ik‐Soo1 (AUTHOR), Park, Hyeji3 (AUTHOR), Eom, In‐Yong3 (AUTHOR), Lee, Jung‐Woon3 (AUTHOR), Park, Ikbum4 (AUTHOR) ibpark@krict.re.kr, Lee, Anna2 (AUTHOR) annalee@postech.ac.kr, Jeong, Unyong1 (AUTHOR) ujeong@postech.ac.kr
Publikováno v: Advanced Functional Materials. Aug2024, p1. 13p. 10 Illustrations.
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6
Akademický článek
Facile Synthesis of Conductive Flexible Composite Sn@Ag Microspheres and their Application in Anisotropic Conductive Films.
Autor: Zhang, Wen Hua1 (AUTHOR), Fan, Pei Yuan1 (AUTHOR), Yu, Xianglei1 (AUTHOR), Cheng, Jun Hua1 (AUTHOR), Cheng, Ding Xiang1 (AUTHOR), Liu, Cheng Bing1 (AUTHOR), Gan, Guo You1 (AUTHOR) ganguoyou@kust.edu.cn, Li, Jun Peng2 (AUTHOR) lijunpeng@ipm.com.cn
Publikováno v: Particle & Particle Systems Characterization. Jan2022, Vol. 39 Issue 1, p1-11. 11p.
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7
Akademický článek
Ablation morphology and characteristic analysis of anisotropic conductive film (ACF) using femtosecond lasers with NIR, Green, and DUV wavelengths for micro-LED display repair.
Autor: Choi, Junha1,2 (AUTHOR), Cho, Kwangwoo1,2,3 (AUTHOR), Cho, Sung-Hak1,2 (AUTHOR) shcho@kimm.re.kr
Publikováno v: Applied Physics A: Materials Science & Processing. Feb2024, Vol. 130 Issue 2, p1-11. 11p.
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9
Akademický článek
Inter-Skeleton Conductive Routes Tuning Multifunctional Conductive Foam for Electromagnetic Interference Shielding, Sensing and Thermal Management
Autor: Xufeng Li, Chunyan Chen, Zhenyang Li, Peng Yi, Haihan Zou, Gao Deng, Ming Fang, Junzhe He, Xin Sun, Ronghai Yu, Jianglan Shui, Caofeng Pan, Xiaofang Liu
Publikováno v: Nano-Micro Letters, Vol 17, Iss 1, Pp 1-18 (2024)
Highlights Unique inter-skeleton conductive films are constructed in polymer foam. The resistance change of the foam can reach four orders of magnitude under compression. This foam exhibits strain-adaptive electromagnetic interference shielding perfo
Externí odkaz: https://doaj.org/article/70793e9b934546dbac6163af5ebc7f33
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10
Akademický článek
Conductive particle detection via deep learning for ACF bonding in TFT-LCD manufacturing.
Autor: Liu, Eryun1 (AUTHOR) eryunliu@zju.edu.cn, Chen, Kangping1 (AUTHOR), Xiang, Zhiyu1 (AUTHOR), Zhang, Jun2 (AUTHOR)
Publikováno v: Journal of Intelligent Manufacturing. Apr2020, Vol. 31 Issue 4, p1037-1049. 13p.
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