Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Collin Dymel"'
Autor:
Reinhard Schemmel, Florian Eacock, Walter Sextro, Collin Dymel, Matthias Hunstig, Michael Brökelmann, Tobias Hemsel
Publikováno v:
International Symposium on Microelectronics. 2019:000509-000514
Ultrasonic joining is a common industrial process. To build electrical connections in the electronics industry, uni-axial and torsional ultrasonic vibration have been used to join different types of workpieces for decades. Many influencing factors li
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2596d2c7f7e8e0321971a5ae62108f17
https://doi.org/10.4071/2380-4505-2019.1.000509
https://doi.org/10.4071/2380-4505-2019.1.000509
Autor:
Collin Dymel, Walter Sextro, Matthias Hunstig, Tobias Hemsel, Reinhard Schemmel, Michael Brökelmann
Publikováno v:
Sensors and Actuators A: Physical. 295:653-662
Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b91780c4edd26a9207dbd40037de8a83
https://doi.org/10.1016/j.sna.2019.04.025
https://doi.org/10.1016/j.sna.2019.04.025
Autor:
Michael Brökelmann, Walter Sextro, Tobias Hemsel, Collin Dymel, Reinhard Schemmel, Matthias Hunstig
Publikováno v:
2018 IEEE CPMT Symposium Japan (ICSJ).
Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm up to 12 mm made from copper are well suited in high power applications. For increasing friction
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c46d2dbb649710d5cec668a36f8301c4
https://doi.org/10.1109/icsj.2018.8602653
https://doi.org/10.1109/icsj.2018.8602653
Autor:
Matthias Hunstig, Tobias Hemsel, dePaul Eichwald, Michael Brökelmann, Walter Sextro, Collin Dymel, deReinhard Schemmel
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased norma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b54af48a45fd15fbc8272a2c116fe66c
https://doi.org/10.1109/estc.2018.8546487
https://doi.org/10.1109/estc.2018.8546487