Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Colin V. Greene"'
Autor:
Colin V. Greene, Ganesh Subbarayan, Yifan Wu, Raiyo Aspandiar, Nilesh Badwe, John E. Blendell, Carol A. Handwerker, Sukshitha Achar Puttur Lakshminarayana, Yaohui Fan, Travis F. Dale
Publikováno v:
Journal of Electronic Materials. 50:6615-6628
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form solder interconnects at significantly lower melting temperatures than required for Sn-Ag-Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2012887ba2cbbd03464dd80d2889a5b
https://doi.org/10.1007/s11664-021-09256-1
https://doi.org/10.1007/s11664-021-09256-1
Autor:
Ranjani N. Moorthi, Tarek M. El-Achkar, Claudio Perez-Ledezma, Katherine J. Kelly, Pierre C. Dagher, Tae Hwi Schwantes-An, Khawaja O. Omar, Michael T. Eadon, Colin V. Greene, Kyle Hart, Ayman Hallab, Sharon M. Moe, Sarah N. Lipp, Anna R. Roberts, Carrie L. Phillips
Publikováno v:
Am J Kidney Dis
RATIONALE AND OBJECTIVE: The use of kidney histopathology for predicting kidney failure is not established. We hypothesized that use of histopathological features of kidney biopsy specimens would improve prediction of clinical outcomes made using dem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9fc97f424a7621df9a6ed9f420741135
https://doi.org/10.1053/j.ajkd.2019.12.014
https://doi.org/10.1053/j.ajkd.2019.12.014