Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Colin Liu"'
Autor:
Jamie A. Browning, Chi Chun Steve Tsang, Xiaobei Dong, Jim Y. Wan, Marie A. Chisholm-Burns, Christopher K. Finch, Jack W. Tsao, Colin Liu, Junling Wang
Publikováno v:
BMC Health Services Research, Vol 22, Iss 1, Pp 1-10 (2022)
Abstract Background Alzheimer’s Disease (AD) is the mostcommon cause of dementia, a neurological disorder characterized by memory loss and judgment impairment. Hyperlipidemia, a commonly co-occurring condition, should be treated to prevent associat
Externí odkaz:
https://doaj.org/article/ac3fa79b68804d58880635825203fe63
Autor:
Sara M. Hanning, Trusha J. Purohit, Jonathan Carruth, Darin Kim, Farhan Dean, Seunghyun Lee, Colin Liu, Manisha Sharma, Sachin S. Thakur
Publikováno v:
Journal of Pharmacy Practice and Research. 51:314-320
Autor:
Navneeth Ramakrishnan, Colin Liu, Jack Hellerstedt, Michael S. Fuhrer, Anton Tadich, Shaffique Adam, Bent Weber, Kane M. O'Donnell, Mark T. Edmonds
Publikováno v:
Nano Letters. 16:3210-3214
Topological Dirac semimetals (TDS) are three-dimensional analogues of graphene, with linear electronic dispersions in three dimensions. Nanoscale confinement of TDSs in thin films is a necessary step toward observing the conventional-to-topological q
Autor:
Chih-Pin Hung, Ding-Bang Luh, Ho-Ming Tong, Colin Liu, Emma Hsieh, Yi-Shao Lai, Shin-Hua Chao
Publikováno v:
Journal of the Chinese Institute of Engineers. 37:827-832
Flip-chip chip-scale packaging (FCCSP) has recently emerged as a package solution achieving superior performance over traditional wire-bonding technology. There are also further possible advances for the assembly process such as under-fill and moldin
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Flip-Chip Chip-Scale Packaging (FCCSP) has recently emerged as one of mainstream package solutions due to the superior performance & miniaturization over the wire-bonding technology. There had been lots of efforts to enhance the assembly process effi