Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Colin Goyette"'
Autor:
Christine Bunke, Mahmoud Khojasteh, James J. Steffes, Colin Goyette, Naftali E. Lustig, Stephan Grunow, Steven E. Molis, M. Zaitz, Leo Tai, Wei-Tsu Tseng, David Steber, Michael Kennett, Laertis Economikos, Adam Ticknor, Praneetha Poloju, Elliott Rill, Michael P. Chudzik, Vamsi Devarapalli, Connie Truong
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 26:493-499
A “hybrid” post Cu CMP cleaning process that combines acidic and basic clean in sequence is developed and implemented. The new process demonstrates the strengths of both acidic and basic cleans and achieves a more than 60% reduction in CMP defect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::546b1e994315b4775c6aac5f28af911e
https://doi.org/10.1109/tsm.2013.2273124
https://doi.org/10.1109/tsm.2013.2273124
Autor:
S. Mittal, Colin Goyette, Christine Bunke, Vamsi Devarapalli, Michael Kennett, Leo Tai, Mahmoud Khojasteh, Steven E. Molis, George F. Ouimet, Elliott Rill, James J. Steffes, Praneetha Poloju, Laertis Economikos, Adam Ticknor, David Steber, Michael P. Chudzik, Wei-Tsu Tseng, Stephan Grunow, Connie Truong, M. Zaitz
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
A “hybrid” post-Cu CMP cleaning process that combines acidic and basic cleans in sequence is developed and implemented. The new process demonstrates the advantages of both acidic and basic cleans and achieves a more than 60% reduction in CMP defe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3e513808e8d012bbc5b66993b075352
https://doi.org/10.1109/asmc.2013.6552758
https://doi.org/10.1109/asmc.2013.6552758