Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Cliff McCold"'
Publikováno v:
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35177a60d190573181e1087f5a4da7ee
https://doi.org/10.1109/asmc57536.2023.10121143
https://doi.org/10.1109/asmc57536.2023.10121143
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Growth in the usage of heterogenous integration and chiplets-based designs in modern advanced packages for leading applications like AI and HPC is driving the need for very large chip sizes that exceed the dimensions of a single back-end stepper expo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::927770d465b8e1aa8940c8758c6aedd6
https://doi.org/10.1109/ectc32696.2021.00321
https://doi.org/10.1109/ectc32696.2021.00321
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Wafer-level packaging with high density fan-out (HDFO) requires multiple redistribution layers (RDL) to handle the high-density interconnections and the large data transfer rates between chips in the package. Decreasing the critical dimension (CD) of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d28c73578bba241778250a7175cea319
https://doi.org/10.1109/ectc32862.2020.00179
https://doi.org/10.1109/ectc32862.2020.00179
Publikováno v:
Microscopy & Microanalysis; Aug2019 Supplement, p1722-1723, 2p
Publikováno v:
Microscopy & Microanalysis; 2018Supplement1, Vol. 24, p1722-1723, 2p