Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Clemens J. M. Lasance"'
Autor:
Clemens J. M. Lasance
Publikováno v:
Heat Transfer Engineering. 29:149-168
In order to reduce design-cycle time and physical prototyping, equipment manufacturers need to ascertain the thermal performance of new systems at the earliest possible stage of the design process. In the early 1990s, some European industries began t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43010424330f95dd92cfd9d875c9087c
https://doi.org/10.1080/01457630701673188
https://doi.org/10.1080/01457630701673188
Autor:
Martine Baelmans, G. Van der Veken, Clemens J. M. Lasance, Herman Oprins, Céline Catherine Sarah Nicole
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:209-217
In this paper, the capability of a novel cooling system for microchannels based on the principle of electrowetting is examined. To start with, the elcctrowetting effect in microchannels is experimentally investigated. The used electrowetting system c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::003692a2274ba03b89d468ea1c5454ce
https://doi.org/10.1109/tcapt.2007.898301
https://doi.org/10.1109/tcapt.2007.898301
Autor:
Clemens J. M. Lasance
Publikováno v:
Journal of Electronic Packaging. 126:565-570
On January 1, 2000, the European project PROFIT commenced as a follow up to the successfully finished EC-funded projects DELPHI, SEED and THERMINIC. PROFIT finished in March 2003. The project aimed at creating methods and tools to enable a sufficient
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::33c1f67c19dca8b6acc4ff802e927ab2
https://doi.org/10.1115/1.1827258
https://doi.org/10.1115/1.1827258
Autor:
Clemens J. M. Lasance
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 27:523-529
It has been repeatedly shown that high accuracy can be obtained when comparing boundary-condition-independent compact thermal models (CTMs) to detailed model results. However, it should be realized that these results have been generated using certain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fb20e2a75a70e9dc428aa7395eb9ae1
https://doi.org/10.1109/tcapt.2004.831788
https://doi.org/10.1109/tcapt.2004.831788
Autor:
Clemens J. M. Lasance
Publikováno v:
Microelectronics Reliability. 43:1969-1974
To meet the needs of future microelectronics and microsystems, we need a paradigm shift in the approach to system reliability. It is emphasized that the scientific success of many nano/micro-related projects will never lead to a business success with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07db2d7d93435491f6ca4da7c66ca953
https://doi.org/10.1016/s0026-2714(03)00183-5
https://doi.org/10.1016/s0026-2714(03)00183-5
Autor:
Ravi Mahajan, David L. Blackburn, Kaveh Azar, Yogendra Joshi, Clemens J. M. Lasance, Jukka Rantala
Publikováno v:
Microelectronics Journal. 34:1195-1201
A panel was organized at the Therminic 2002 workshop to address the question posed in the title of this summary paper. Brief presentations were made by the six panelists, followed by an open discussion among Workshop participants. The focus of the pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b40b4694e976075120a069ff2ba4a12f
https://doi.org/10.1016/s0026-2692(03)00200-3
https://doi.org/10.1016/s0026-2692(03)00200-3
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 25:533-538
Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context of current industrial nee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa6bb68fb7b000d671cbb86b247fb621
https://doi.org/10.1109/tcapt.2002.808001
https://doi.org/10.1109/tcapt.2002.808001
Publikováno v:
Microelectronics Journal. 32:797-800
The rapidly shrinking times-to market for modern electronic products are requiring high fidelity system level thermal simulations. Electronic products are characterized by diverse length scales of interest, multiple coupled modes of thermal transport
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d38aadc6a921225b91dba3f043de9eb2
https://doi.org/10.1016/s0026-2692(01)00065-9
https://doi.org/10.1016/s0026-2692(01)00065-9
Autor:
Clemens J. M. Lasance
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 24:559-565
The paper discusses two benchmark cases to facilitate the study of compact thermal models for the purpose of component thermal characterization. The benchmarks represent idealised concepts of respectively a leaded package (PFQP-style) and an area-arr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d9b66b90cd348239ea229255a72f828
https://doi.org/10.1109/6144.974943
https://doi.org/10.1109/6144.974943
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 20:392-398
For pt.I see ibid., vol.20, no.4, pp.384-91 (1997). The purpose of the second part of the DELPHI survey paper is twofold. First, to describe the experimental methods that have been developed to validate the numerical models generated to characterize
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47991cbe0dbbd7a4a6d88c9636f90355
https://doi.org/10.1109/95.650928
https://doi.org/10.1109/95.650928