Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Clemens, Benedict"'
Autor:
Nyffeler, Clemens Benedict
Electronics today permeate our life and existence. It has become nearly impossible to evade any dependence on electronic devices that surround us every day - computers, phones, televisions. But also other objects become increasingly "smart" - watches
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07465b31cb31508321efcb8c31a60958
Autor:
Sunday Manyenya, Jeffrey Dirawo, Frances M. Cowan, Lisa F. Langhaug, Raluca Buzdugan, Andrew Copas, Clemens Benedict, Godfrey Woelk, Oscar Mundida
Publikováno v:
Tropical Medicine & International Health. 17:827-835
Objective To assess reported HIV knowledge and attitudes, sexual behaviours and HIV testing in Zimbabwe. Methods Representative household surveys of all 18–24 year olds and a proportion of 25–44 year olds were conducted in six purposefully select
Autor:
Lisa, Langhaug, Raluca, Buzdugan, Andrew, Copas, Jeffrey, Dirawo, Clemens, Benedict, Oscar, Mundida, Sunday, Manyenya, Godfrey, Woelk, Frances, Cowan
Publikováno v:
Tropical medicineinternational health : TMIH. 17(7)
To assess reported HIV knowledge and attitudes, sexual behaviours and HIV testing in Zimbabwe.Representative household surveys of all 18-24 year olds and a proportion of 25-44 year olds were conducted in six purposefully selected rural districts in t
Publikováno v:
Finance & Development; Jun2002, Vol. 39 Issue 2, p17, 4p, 2 Color Photographs, 1 Diagram, 1 Chart, 1 Graph
Autor:
Nyffeler, Clemens Benedict
Electronics today permeate our life and existence. It has become nearly impossible to evade any dependence on electronic devices that surround us every day - computers, phones, televisions. But also other objects become increasingly "smart" - watches
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______185::9eca945584df2ced643b90b98129ed9e
https://infoscience.epfl.ch/record/222937
https://infoscience.epfl.ch/record/222937
In this work, a chip-level post-CMOS processing protocol for 3D integration is presented to achieve multilayer stacking. This protocol includes TSV formation on the top chip, bonding the chips on top of each other, and finally the electrical connecti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______185::061ccbaae4789b4fd4473d5fe94b4b79
https://infoscience.epfl.ch/record/202066
https://infoscience.epfl.ch/record/202066