Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Clayton Neff"'
Publikováno v:
Designs, Vol 4, Iss 2, p 14 (2020)
The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of tra
Externí odkaz:
https://doaj.org/article/4db27dcf8999405a98496e882c3e0020
Publikováno v:
Nanotechnology in Space ISBN: 9781003131915
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d671a5a76210e959aefef667f620051b
https://doi.org/10.1201/9781003131915-4
https://doi.org/10.1201/9781003131915-4
Autor:
Thomas M. Weller, Eduardo A. Rojas-Nastrucci, Nathan B. Crane, Darrell Griffin, Justin Nussbaum, Clayton Neff
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1151-1160
Additive manufacturing (AM) of electronics provides a route for creating customized systems with novel geometries that are not feasible with traditional methods. Standard AM processes such as extrusion can produce substrates on which electrical trace
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f2767f3285a7948c8afef64ec4cf6c7
https://doi.org/10.1109/tcpmt.2019.2910791
https://doi.org/10.1109/tcpmt.2019.2910791
Publikováno v:
Designs, Vol 4, Iss 14, p 14 (2020)
Designs; Volume 4; Issue 2; Pages: 14
Designs; Volume 4; Issue 2; Pages: 14
The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of tra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a7151c60b9def3ca9336fcc7a1cb43e6
https://www.mdpi.com/2411-9660/4/2/14
https://www.mdpi.com/2411-9660/4/2/14
Publikováno v:
Additive Manufacturing. 22:807-816
Typically, additive manufacturing (AM) processes are limited to a single material per build while many products benefit from the integration of multiple materials with varied properties. To achieve the benefits of multiple materials, the geometric fr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccdc958f78ea2302ed20a006d25c0541
https://doi.org/10.1016/j.addma.2018.07.005
https://doi.org/10.1016/j.addma.2018.07.005
Publikováno v:
Rapid Prototyping Journal. 24:501-508
Purpose Additive manufacturing (AM) is readily capable of producing models and prototypes of complex geometry and is advancing in creating functional parts. However, AM processes typically underperform traditional manufacturing methods in mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19a9310b4a7c1152f79c80dfa799958f
https://doi.org/10.1108/rpj-03-2017-0039
https://doi.org/10.1108/rpj-03-2017-0039
Publikováno v:
Additive Manufacturing. 20:156-163
The integration of novel additively manufactured (AM) materials and processes with traditional materials and manufacturing techniques, including the insertion of commercial off-the-shelf (COTS) components such as resistors, switches, batteries and li
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12d686feb32a6065520d0cd1aa202746
https://doi.org/10.1016/j.addma.2018.01.009
https://doi.org/10.1016/j.addma.2018.01.009
Autor:
Kenneth Church, Justin Nussbaum, Nathan B. Crane, Harvey Tsang, Casey Perkowski, Clayton Neff, Patrick B. Nesbitt, Jing Wang, Juan Castro, Thomas M. Weller, Paul I. Deffenbaugh, Thomas P. Ketterl
Publikováno v:
Proceedings of the IEEE. 105:688-701
Direct digital manufacturing (DDM) is an emerging technology that is finding its place across a wide array of industries and applications as a cost-effective solution for low volume and mass customizable production. This technology encompasses a clas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7088b494155f81e1394ea0f35e1d707d
https://doi.org/10.1109/jproc.2017.2653178
https://doi.org/10.1109/jproc.2017.2653178
Publikováno v:
International Symposium on Microelectronics. 2016:000250-000266
I. Abstract This paper will discuss the development of additive manufacturing as a process integration methodology for printed electronics and 3D printed structures. This integration enables the ability to move from printed circuit boards (PCBs) to p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::616506834d450bd44da204ac0c937952
https://doi.org/10.4071/isom-2016-wp13
https://doi.org/10.4071/isom-2016-wp13
Publikováno v:
Flexible and Printed Electronics. 4:035005
In this work, two AM technologies were utilized to compare the effectiveness of fabricating a simple electronic device with a conductive trace and hollow cylinder representative of 'printed packaging' that would survive harsh environmental conditions
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7b62561f9d977f5f12b0dc29454bf2a
https://doi.org/10.1088/2058-8585/ab38e9
https://doi.org/10.1088/2058-8585/ab38e9