Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Ciprian Ionescu"'
Publikováno v:
Recent Progress in Science and Technology Vol. 8 ISBN: 9788119102747
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5757dc57034d9e8d924199265d0e6e9
https://doi.org/10.9734/bpi/rpst/v8/18843d
https://doi.org/10.9734/bpi/rpst/v8/18843d
Autor:
Bogdan Mihailescu, Ciprian Ionescu, Daniel Comeaga, Gaudentiu Varzaru, Mihai Branzei, Florin Baciu
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Publikováno v:
Chips; Volume 1; Issue 1; Pages: 14-29
In mixed-signal integrated circuits, interference between digital noisy and sensitive analog/RF circuits is a challenging performance issue. The high cost of chip fabrication requires accurate simulation of the circuits’ performance versus signal a
Autor:
Gaudentiu Varzaru, Razvan Ungurelu, Mihai Branzei, Bogdan Mihailescu, Ciprian Ionescu, Paul Svasta
Publikováno v:
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Autor:
Razvan Ungurelu, Gaudentiu Varzaru, Simona Gheorghe, Marin Gheorghe, Mihai Branzei, Ciprian Ionescu, Bogdan Mihailescu, Paul Svasta
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
A study was conducted on increasing the current carrying capability of conductor tracks made of electrically conductive composite materials to know the limitations when used in the manufacture of electronic modules by additive techniques. Conductor t
Autor:
Mihaela Pantazica, Bogdan Mihailescu, Norocel Codreanu, Madalin Vasile Moise, Ciprian Ionescu, Cristian Boianceanu, Paul Svasta, Alexandru Vasile
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE)
The paper is a part of a larger study regarding reliability aspects of high power DMOS (Double-diffused MOS) transistors, as part of automotive integrated electronics. When submitted to high transient loads, the junction temperature of these devices
Publikováno v:
Advanced Topics in Optoelectronics, Microelectronics and Nanotechnologies X.
Publikováno v:
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Summary: In the field of car electronics, in addition to the harsh conditions of temperature $(-40^{\circ}\mathrm{C}-+130^{\circ}\mathrm{C})$ and wide-spectrum vibrations, there is a danger of the vehicle igniting in the event of impacts producing a
Publikováno v:
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The supercapacitor, the relatively new passive component in the electronic field, has begun drawing attention to more and more users in terms of energy storage and delivery applications in a very short time. Researchers are trying to constantly impro
Autor:
Mihai Branzei, Bogdan Mihailescu, Gaudentiu Varzaru, Marin Gheorghe, Ciprian Ionescu, Paul Svasta, Razvan Ungurelu
Publikováno v:
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The paper presents the investigation of composite structures made by overlapping two or more layers of resins, including conductive resins, at different time intervals, as well as different temperatures. This situation occurs in the case of a model o