A Novel Multi-Scale Method for Thermo-Mechanical Simulation of Power Integrated Circuits

Autor: Adrian Bojita, Marius Purcar, Dan Simon, Ciprian Florea, Cristian Boianceanu, Vasile Topa

Publikováno v: IEEE Journal of the Electron Devices Society, Vol 10, Pp 169-179 (2022)

During development of power Integrated Circuits (IC), several iterations between the design and test/ measurement steps are performed. Computer-aided engineering significantly shortens the product development process because the numerical simulations

Externí odkaz: https://doaj.org/article/806a0a9f41954f098e6a354124bc4f61

Electro-Thermal Simulation of Power DMOS Devices Operating under Fast Thermal Cycling

Autor: Dan Simon, Ciprian Florea, Vasile Topa

Publikováno v: International Symposium for Design and Technology of Electronics Packages (SIITME)
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)

An electro-thermal simulation setup using a FEM-based simulator is being calibrated for adequate modelling of the thermal behavior of a DMOS power transistor operating under fast thermal cycling. The computational domain is defined by selecting the e

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::afd5eca92d0e96fcec75e6298541d3c4

Extraction of Equivalent Mechanical Properties for Power ICs Metallization

Autor: Dan Simon, Cazimir Bostan, Ciprian Florea, Vasile Topa, Marius Purcar

Publikováno v: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

A finite element method analysis using the concepts of representative volume element and periodic boundary conditions is carried out in order to determine the equivalent linear-elastic properties for a multi-level routing metallization typically foun

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6e31aa6cfa8be739394d04b3fc7b4f87
https://doi.org/10.1109/therminic.2019.8923452

A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits

Autor: Ciprian Florea, Adrian Bojita, Cristian Boianceanu, Cosmm-Sorm Plesa, Marius Purcar

Publikováno v: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

The lifetime of power DMOS devices subjected to Thermal Induced Plastic Metal Deformation (TPMD) is highly dependent on the design of the metallization systems and thus requires the understanding of temperature, stress and strain distribution. This p

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::623836739fede15c2ac09acaee389fcf
https://doi.org/10.1109/therminic.2017.8233803