Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Cindy Ruckmar"'
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
In current industrial electronics manufacturing, miniaturized devices and a variety of different device package shapes on one printed circuit board (PCB) are a particular challenge. In this paper, the highly miniaturized 01005 and Land Grid Array (LG
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea5f9605876270bcc368ea71378ee8b2
https://doi.org/10.1109/isse51996.2021.9467586
https://doi.org/10.1109/isse51996.2021.9467586
Autor:
Reinhard Bauer, Cindy Ruckmar, Philipp Zink, Anna Schmid, Carolin Henning, Gunther Gobel, Kathrin Harre
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
This paper deals with the production of PLA wiring substrates. Firstly, the heat distortion temperature of PLA is improved at higher temperatures by an annealing process. Double-sided PLA wiring carriers were realized by means of through-hole plating
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::518beb6e4ebeaaaccf895684c28401fb
https://doi.org/10.1109/isse49702.2020.9121011
https://doi.org/10.1109/isse49702.2020.9121011
Publikováno v:
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
The need for alternatives for petrochemical circuit board materials is increasing annually. This paper deals with the study of ternary PLA composites, containing cellulose acetate (CA) and zinc pyrophosphate (ZnPP), the comparison to previous binary
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d0035b4173a5940ae1156e1a33eaecc
https://doi.org/10.1109/isse.2019.8810257
https://doi.org/10.1109/isse.2019.8810257