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pro vyhledávání: '"Cilingiroglu, Tenzile Berkin"'
Autor:
Cilingiroglu, Tenzile Berkin
The increasing density and smaller length scales in integrated circuits (ICs) create resolution challenges for optical failure analysis techniques. Due to flip-chip bonding and dense metal layers on the front side, optical analysis of ICs is restrict
Externí odkaz:
https://hdl.handle.net/2144/15189
Autor:
Vigil, Kyle1 klvigil@bu.edu, Yang Lu2, Yurt, Abdulkadir3, Cilingiroglu, Tenzile Berkin4, Bifano, Thomas G.2, Ünlü, M. Selim1,4, Goldberg, Bennett B.1,4
Publikováno v:
Electronic Device Failure Analysis. May2014, Vol. 16 Issue 2, p26-32. 7p.
