Zobrazeno 1 - 10
of 90
pro vyhledávání: '"Ciccomancini Scogna, A."'
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 60:952-957
Mode conversion in differential lines paired with serpentine in PCB layouts of mobile electronic devices is investigated. Different shapes and dimensions are analyzed and design of experiments based on Response Surface Model is used to study the sens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da6abf1966343aeb543a67f8bf31077b
https://doi.org/10.1109/temc.2017.2764526
https://doi.org/10.1109/temc.2017.2764526
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:554-561
In mobile platforms, RF interference issues caused by the switched-mode power supply (SMPS) ringing noise often arise in the on-the-go mode and the charging mode of the interface power management integrated circuits. In this paper, we introduce the m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b09330140f968ec2679a0a52e7b5e492
https://doi.org/10.1109/tcpmt.2018.2799330
https://doi.org/10.1109/tcpmt.2018.2799330
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. :1-6
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::820eed34314787e202056a8edcad8ab2
https://doi.org/10.1109/temc.2018.2817259
https://doi.org/10.1109/temc.2018.2817259
Publikováno v:
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC).
Optimization methodology of USB 3.1 Gen 1 serial link interface on mobile devices is proposed. The goal is upgrading to USB 3.1 Gen 2 which is running at 10 GB/s. Rigorous 3D electromagnetic full-wave modeling based on a divide and conquer approach i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::276886aeb911d6ea55f170fd3ac3382a
https://doi.org/10.1109/isemc.2018.8393730
https://doi.org/10.1109/isemc.2018.8393730
Method of Effective Roughness Dielectric in a PCB: Measurement and Full-Wave Simulation Verification
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 57:807-814
Surface roughness topography of printed circuit boards (PCBs) needs to be included in signal integrity simulations in order to accurately predict the insertion loss of the structure and its delay time. An effective roughness dielectric (ERD) model ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::239ebb31faa70bcfb1d5ae7191ecc33d
https://doi.org/10.1109/temc.2015.2412113
https://doi.org/10.1109/temc.2015.2412113
Autor:
YongHyock Lee, Albert Baek, Dong Sub Kim, Nitin Srivastava, Antonio Ciccomancini Scogna, Hwanwoo Shim
Publikováno v:
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
Signal and power integrity co-simulation is essential to study the impact of the power delivery network (PDN) on the performance of a high speed interface. PDN noise is directly related to its impedance profile which can be controlled by decoupling c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4d59c930ebbb8405d9e60423b9fb322
https://doi.org/10.1109/apemc.2017.7975463
https://doi.org/10.1109/apemc.2017.7975463
Publikováno v:
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
In mobile platforms, the 3-level buck converters are newly adopted in IF PMICs to support the fast charging mode. Despite the new adoption, we cannot avoid the ringing noises at the switch transitions which cause significant RFI issues in mobiles. In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8468e281d090b9b82ef9b360a6324c65
https://doi.org/10.1109/apemc.2017.7975469
https://doi.org/10.1109/apemc.2017.7975469
Autor:
Darryl Kostka, Robert Trieb, Andy Heinig, Alexander Steinhardt, Matthias Troescher, Antonio Ciccomancini Scogna, Andreas Henkel
Publikováno v:
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).
The goal of this work is to electrically model TSVs and 3D interposer interconnects by means of three dimensional (3D) full wave electromagnetic simulations and a circuit like approach for a very fast simulation. The full wave simulations provide a c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83333a581c8a813535c1c56037ae92e4
https://doi.org/10.1109/isemc.2016.7571684
https://doi.org/10.1109/isemc.2016.7571684
Publikováno v:
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI).
SIPI co-simulation is common practice for simultaneous switching noise (SSN) analysis at system level including PCB, package and die. However, SPICE models of the signal nets and the power delivery network (PDN) are usually separately extracted. A SI
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0c3f2f0771592735b8e665d02e28e47
https://doi.org/10.1109/sapiw.2016.7496273
https://doi.org/10.1109/sapiw.2016.7496273
Publikováno v:
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
In mobile platforms, RFI problems caused by the noises on switched-mode power supplies (SMPSs) have arisen. The SMPS noise which affects RF bands is generated by the voltage ringing at the switch transitions in the SMPS operation. This voltage ringin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82b05f6ed0142277f14fdf8926728a14
https://doi.org/10.1109/edaps.2016.7893115
https://doi.org/10.1109/edaps.2016.7893115