Zobrazeno 1 - 10
of 123
pro vyhledávání: '"Cian O'Mathuna"'
Publikováno v:
Microsystems & Nanoengineering, Vol 7, Iss 1, Pp 1-12 (2021)
Abstract As demand accelerates for multifunctional devices with a small footprint and minimal power consumption, 2.5D and 3D advanced packaging architectures have emerged as an essential solution that use through-substrate vias (TSVs) as vertical int
Externí odkaz:
https://doaj.org/article/f5fdcee8326a4b61b48679ae2bd08e04
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-12 (2021)
Abstract The emergence of perpendicular magnetic anisotropy (PMA) in amorphous thin films, which eventually transforms the magnetic spins form an in-plane to the out-of-plane configuration, also known as a spin-reorientation transition (SRT), is a fu
Externí odkaz:
https://doaj.org/article/5d8c7a684d40411b8f23f4d88d09c371
Publikováno v:
EAI Endorsed Transactions on Ambient Systems, Vol 1, Iss 1, Pp 1-12 (2011)
It is commonly agreed that a 15–40% reduction of building energy consumption is achievable by efficiently operated buildings when compared with typical practice. Existing research has identified that the level of information available to Building M
Externí odkaz:
https://doaj.org/article/7f321bbfee114807b4d0e14da821eaac
Publikováno v:
International Journal of Distributed Sensor Networks, Vol 9 (2013)
A thermoelectric energy harvester powered wireless sensor networks (WSNs) module designed for building energy management (BEM) applications is built and tested in this work. An analytic thermoelectric generator (TEG) electrical model is built and ver
Externí odkaz:
https://doaj.org/article/c8ffc837d5af4337964e4ba229789e08
Publikováno v:
IEEE Transactions on Power Electronics. 38:4909-4920
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::223ce7e66400fa6f78edb9f9f1c2252f
https://doi.org/10.1109/tpel.2022.3226708
https://doi.org/10.1109/tpel.2022.3226708
Publikováno v:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::887a2e5708a6424ea3ae524bcb2d87ab
https://doi.org/10.1109/apec43580.2023.10131506
https://doi.org/10.1109/apec43580.2023.10131506
Autor:
Ruaidhrí Murphy, Pablo Zumel, Séamus O’Driscoll, Zoran Pavlovic, Cristina Fernández, Cian O'Mathuna, Jaime Lopez Lopez
Publikováno v:
e-Archivo. Repositorio Institucional de la Universidad Carlos III de Madrid
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Present needs in efficiency and integration drive research toward the miniaturization of power converters. Among the latest components to achieve the desired degree of integration are cored micro-inductors that are still one of the hardest devices to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8d80fbb9bbd1abfee5402c4d555a21dd
https://doi.org/10.1109/jestpe.2021.3094631
https://doi.org/10.1109/jestpe.2021.3094631
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-12 (2021)
Scientific Reports
Scientific Reports
The emergence of perpendicular magnetic anisotropy (PMA) in amorphous thin films, which eventually transforms the magnetic spins form an in-plane to the out-of-plane configuration, also known as a spin-reorientation transition (SRT), is a fundamental
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1827c52e683afd343010da7449c34dab
https://doaj.org/article/5d8c7a684d40411b8f23f4d88d09c371
https://doaj.org/article/5d8c7a684d40411b8f23f4d88d09c371
Autor:
Flemming Jensen, Arnold Knott, Yasser Nour, Zoran Pavlovic, Ziwei Ouyang, Cian O'Mathuna, Anpan Han, Hoa Thanh Le, Santosh Kulkarni
Publikováno v:
IEEE Transactions on Power Electronics. 34:74-85
The integration of power inductors is a roadblock in realizing highly miniaturized power supply in package (PSiP) and power supply on chip. Inductors in such power systems are used for energy storage and filtering, but they dominate in size and loss.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b0c3367e9eb0e548e5379fe2c9546f8
https://doi.org/10.1109/tpel.2018.2847439
https://doi.org/10.1109/tpel.2018.2847439
Publikováno v:
Microsystems & Nanoengineering, Vol 7, Iss 1, Pp 1-12 (2021)
As demand accelerates for multifunctional devices with a small footprint and minimal power consumption, 2.5D and 3D advanced packaging architectures have emerged as an essential solution that use through-substrate vias (TSVs) as vertical interconnect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fb91fb05b2d5424e143cc3d9d2fbe3d7
https://hdl.handle.net/10468/11547
https://hdl.handle.net/10468/11547
