Zobrazeno 1 - 10
of 48
pro vyhledávání: '"Chunshan Du"'
Publikováno v:
IEEE Transactions on Intelligent Transportation Systems. :1-9
Autor:
Kan Zhou, Qijian Wan, Ao Chen, Wenzhan Zhou, Chunshan Du, Recoo Zhang, Yu Zhang, Wenming Wu, Germain Fenger, Seshadri Rampoori
Publikováno v:
2022 International Workshop on Advanced Patterning Solutions (IWAPS).
Autor:
Rui Xu, Xuan Li, Yao Jin, Xiaolong Jiang, Lingxue Yang, Kun Ren, Yongyu Wu, Dawei Gao, Chunshan Du, Qijian Wan, Xinyi Hu, Sihang Zou, Fan Jiang, Le Hong
Publikováno v:
2022 International Workshop on Advanced Patterning Solutions (IWAPS).
Autor:
Kan Zhou, Hongwen Zhao, Wenzhan Zhou, Yu Zhang, Ao Chen, Wenming Wu, Qijian Wan, Huaiyang Dou, Chunshan Du, Liguo Zhang, Germain Fenger
Publikováno v:
2022 International Workshop on Advanced Patterning Solutions (IWAPS).
Autor:
Yining Chen, Pang Guo, Joe Kwan, Aliaa Kabeel, Sarah Rizk, Chunshan Du, Xinyi Hu, Qijian Wan, Xizi Yan
Publikováno v:
2022 International Workshop on Advanced Patterning Solutions (IWAPS).
Autor:
Yinsheng Yu, Guoping Liu, Hongwen Zhao, Kan Zhou, Yuhui Li, Wenzhan Zhou, Yu Zhang, Qijian Wan, Ao Chen, Chunshan Du, Liguo Zhang, Germain Fenger
Publikováno v:
2021 International Workshop on Advanced Patterning Solutions (IWAPS).
Autor:
Wenzhan Zhou, Ao Chen, Huaiyang Dou, Chunshan Du, Yinsheng Yu, Yu Zhang, Wenming Wu, Kan Zhou, Germain Fenger, Qijian Wan, Hongwen Zhao, Xin Guo, Liguo Zhang
Publikováno v:
Photomask Technology 2021.
The mask CD mean-to-target (MTT) has been widely adopted as one of the key metrics for the mask quality control. As more aggressive optical proximity correction (OPC) is applied to push the resolution limit, traditional CDSEM measurement-based metrol
Autor:
Bhamidipati Samir, Wenzhan Zhou, Wenming Wu, Kan Zhou, Chunshan Du, Germain Fenger, Recoo Zhang, Ao Chen, Xin Guo, Seshadri Rampoori, Qijian Wan
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
In this paper, we present the flow and results of contour-based process characterization, modeling and control used for semiconductor manufacturing. First, high-quality contours are extracted from large field of view (FOV) SEM images based on the imp
Autor:
Qijian Wan, Marfei Fei, Jet Jiang, Frank Hou, Elven Huang, Gavin Li, David Wang, Summy Chen, Liang Cao, Saikiran Madhusudhan, Sankaranarayanan Paninjath, Leo Tian, Chunshan Du, Xinyi Hu, Qian Xie
Publikováno v:
2020 International Workshop on Advanced Patterning Solutions (IWAPS).
As the semiconductor manufacturing continues its march towards more advanced technology nodes, design and process introduced systematic defects become significant yield limiters [1]. Therefore, identification and characterization of these systematic
Autor:
Yizhong Zhang, Shirui Yu, Min Wang, Xinyi Hu, Chunshan Du, Zhengfang Liu, Qijian Wan, Zhixi Chen
Publikováno v:
Design-Process-Technology Co-optimization for Manufacturability XIV.
High yield is always demanded in IC manufacturing, however, as process variations and random particles are part of the manufacturing process in nature, yield and circuit performance are inevitably impacted by these factors especially in advanced node